MICROELECTRONICS INTERNATIONAL is a distinguished peer-reviewed journal published by Emerald Group Publishing Ltd, focusing on the expansive domains of microelectronics, materials science, and physics. With its ISSN 1356-5362 and E-ISSN 1758-812X, the journal has been a critical platform for researchers since its inception in 1982. Although it currently holds a Q4 category ranking across multiple disciplines such as Atomic and Molecular Physics, Electronic Engineering, and Surfaces, Coatings and Films, it remains committed to advancing scholarship and fostering dialogue within these fields. The journal's scope encompasses innovative research and developments that contribute to the understanding and technological evolution of microelectronic materials and systems. While it doesn't offer open access, its content is accessible through various academic databases, enabling a broad audience of professionals and enthusiasts to engage with high-quality research findings. As microelectronics continues to play a pivotal role in shaping modern technology, MICROELECTRONICS INTERNATIONAL serves as an essential resource for advancing knowledge and inspiring future innovations.

The International Journal of Reliability Quality and Safety Engineering, published by World Scientific Publishing Co Pte Ltd, is a leading platform for disseminating cutting-edge research in the fields of reliability, quality, and safety engineering. With an impressive scope that spans across aerospace, electrical engineering, nuclear energy, and industrial manufacturing, this journal serves as a critical resource for researchers and professionals aiming to enhance system dependability and operational excellence. Indexed in Scopus, it holds a respectable Q3 ranking across various categories in 2023, reflecting its growing influence in the academic community. Although currently not open access, it provides ample opportunities for scholars to publish impactful studies from its extensive database, which has evolved since 1996. The journal's commitment to advancing knowledge in reliability and safety engineering makes it a pivotal resource for those dedicated to improving engineering practices and protocols worldwide.

Engineering Failure Analysis is a prestigious peer-reviewed journal published by PERGAMON-ELSEVIER SCIENCE LTD, dedicated to advancing the field of engineering through comprehensive investigations into the causes and consequences of failures in various engineering domains. Established in 1994, the journal has become a cornerstone of knowledge in sectors such as Aerospace, Automotive, and Materials Science, earning its place within the Q1 quartile across multiple relevant categories in 2023. With a broad scope that encompasses topics related to safety, risk, reliability, and quality, it serves as a vital resource for researchers, professionals, and students keen on understanding how to mitigate failures and improve engineering practices. Although this journal does not currently offer Open Access, its impact is underscored by its high Scopus ranking, where it sits comfortably in the 36th position out of 307 in General Engineering. By bridging theoretical insights and practical applications, Engineering Failure Analysis plays a pivotal role in shaping the future of engineering standards and safety practices.

INFORMACIJE MIDEM - JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS is a prominent open-access journal published by SOC MICROELECTRONICS, ELECTRON COMPONENTS MATERIALS-MIDEM in Slovenia, dedicated to advancing knowledge in the fields of microelectronics, electronic components, and materials. Since its inception in 1988, the journal has provided a platform for groundbreaking research and innovations, ensuring that all published work is freely accessible to a global audience. With an impressive history of publication from 1996 to 2024, INFORMACIJE MIDEM is indexed in Scopus, holding respectable ranks in categories such as Electrical and Electronic Engineering (Rank #525/797, Percentile 34th) and Electronic, Optical, and Magnetic Materials (Rank #204/284, Percentile 28th). While currently classified in the Q4 quartile for the year 2023, the journal serves as an essential resource for researchers, professionals, and students seeking the latest developments in microelectronics and related fields, fostering a collaborative academic environment and contributing to the advancement of technology and materials science.

The International Journal of Rotating Machinery, published by Hindawi Ltd, is a prominent open-access journal dedicated to advancing research and innovation in the fields of Mechanical Engineering and Industrial and Manufacturing Engineering. Since its inception in 1994, the journal has been committed to disseminating high-quality research articles that explore the mechanics, performance, and design of rotating machinery, which are critical in various industrial applications. The journal has established itself within the academic community, earning a Q3 category ranking in both its specialized fields as of 2023. With a robust history spanning converged years from 1994 to 2024, and an active presence in major indexing databases, it serves as an essential resource for researchers, practitioners, and students keen to stay at the forefront of engineering advancements. Notably, the journal's open access policy ensures that all articles are freely available, fostering greater collaboration and sharing of knowledge within the global engineering community.

Materials Performance and Characterization is a distinguished journal published by the American Society for Testing and Materials (ASTM), specializing in the field of materials science. With ISSN 2379-1365 and E-ISSN 2165-3992, this journal serves as a pivotal platform for disseminating innovative research in the areas of metals and alloys, polymers and plastics, ceramics and composites, and mechanics of materials. Established in 2012, it continues to feature peer-reviewed articles that contribute to both theoretical advancements and practical applications, emphasizing the importance of materials performance in various industries. Despite its current Q4 and Q3 rankings across categories as of 2023, the journal is committed to enhancing its influence in the materials science community, fostering engagement among researchers, professionals, and students alike. The journal is essential for anyone seeking to stay at the forefront of materials research and characterization.

SOFTWARE TESTING VERIFICATION & RELIABILITY, published by Wiley, serves as a premier journal in the fields of software engineering, risk management, and quality assurance. With an ISSN of 0960-0833 and E-ISSN 1099-1689, this journal has been a pivotal resource since its inception in 1991, providing insights into the latest methodologies and technologies related to software testing and verification through to 2024. The journal is recognized for its rigorous peer-review process and boasts an impressive reputation, rated Q2 in Media Technology and Safety, Risk, Reliability and Quality, along with a Q3 rank in Software as of 2023. Its Scopus ranks further solidify its standing within the academic community, placing it in the 62nd and 43rd percentiles for Engineering and Computer Science, respectively. The journal fosters a collaborative environment for researchers, professionals, and students, encouraging the exploration of cutting-edge research, applications, and innovations in software testing and reliability, making it an invaluable asset for those seeking to advance their knowledge and expertise in this essential area.

JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS is a leading academic journal published by SPRINGER, dedicated to advancing the field of electronic testing through innovative research and applications. With an ISSN of 0923-8174 and an E-ISSN of 1573-0727, this journal plays a vital role in disseminating significant findings and methodologies that enhance the reliability and performance of electronic systems. Based in the Netherlands, with a prominent address at ONE NEW YORK PLAZA, SUITE 4600, NEW YORK, NY 10004, UNITED STATES, the journal covers a broad spectrum of topics related to electronic testing, making it essential reading for researchers, professionals, and students in the Electrical and Electronic Engineering domain. In the 2023 ranking, it holds a Category Quartile of Q3 and is ranked #495 out of 797 journals in Scopus, reflecting its contributions to the discipline. Although it does not provide open access options, readers and contributors can engage with high-caliber research from 1990 through to 2024, further emphasizing its commitment to the ongoing evolution of electronic testing methodologies.

Nondestructive Testing and Evaluation, published by Taylor & Francis Ltd, is a premier international journal dedicated to the dissemination of innovative research and practices in the field of nondestructive testing and evaluation. With a robust ISSN of 1058-9759 and an E-ISSN of 1477-2671, this journal has consistently served as a vital resource for researchers, professionals, and students interested in enhancing the safety and reliability of materials and structures through advanced testing techniques. The journal's significant impact, evidenced by its Q2 rankings across multiple categories—including Materials Science, Mechanical Engineering, and Physics and Astronomy, along with commendable Scopus rankings—reflects its commitment to high-quality scholarship. Covering the convergence of research from 1989 to 2024, Nondestructive Testing and Evaluation plays a crucial role in advancing methodologies that drive innovation in various engineering disciplines. While currently not offering an Open Access option, the journal remains a respected platform for exchanging knowledge that shapes the future of nondestructive methodologies.

Journal of Failure Analysis and Prevention, published by SpringerNature, stands as a vital resource in the fields of Materials Science, Mechanical Engineering, and Safety, Risk, Reliability and Quality. With an ISSN of 1547-7029 and an E-ISSN of 1864-1245, this journal has been dedicated to advancing the understanding of failure mechanisms and prevention strategies since its inception in 2001. Its convergence of rigorous research from various domains underscores its importance, achieving a Q3 classification across multiple engineering categories as of 2023. As of the latest rankings, it holds significant positions, including #114 in Safety, Risk, Reliability and Quality and #408 in Mechanical Engineering, illustrating its role in fostering scholarly dialogue and innovation. Although it does not currently offer open-access options, the journal endeavors to be accessible for researchers and professionals seeking impactful, high-quality analyses that inform both safety practices and engineering improvements. Whether you are a researcher pushing the boundaries of knowledge or a professional applying these principles, the Journal of Failure Analysis and Prevention is an indispensable part of your academic toolkit.