IEEE Transactions on Device and Materials Reliability stands as a leading journal in the field of reliability engineering, specializing in the intricate connections between device performance and materials efficacy. Published by the renowned IEEE-Institute of Electrical and Electronics Engineers Inc., this journal boasts a commendable impact factor and exhibits robust Scopus rankings across various categories, including electrical and electronic engineering and safety, risk, reliability, and quality. With a publication timeline from 2001 to 2024, it serves as an essential resource for researchers and professionals alike, providing comprehensive insights into current advancements and challenges in device reliability and materials science. Although it operates under a subscription model, the journal's extensive contributions are crucial for fostering significant innovations that ensure the integrity and longevity of electronic devices in a rapidly evolving technological landscape. Researchers, professionals, and students delving into this vital domain will find IEEE Transactions on Device and Materials Reliability a valuable platform to disseminate their findings and explore the latest trends.

Engineering Failure Analysis is a prestigious peer-reviewed journal published by PERGAMON-ELSEVIER SCIENCE LTD, dedicated to advancing the field of engineering through comprehensive investigations into the causes and consequences of failures in various engineering domains. Established in 1994, the journal has become a cornerstone of knowledge in sectors such as Aerospace, Automotive, and Materials Science, earning its place within the Q1 quartile across multiple relevant categories in 2023. With a broad scope that encompasses topics related to safety, risk, reliability, and quality, it serves as a vital resource for researchers, professionals, and students keen on understanding how to mitigate failures and improve engineering practices. Although this journal does not currently offer Open Access, its impact is underscored by its high Scopus ranking, where it sits comfortably in the 36th position out of 307 in General Engineering. By bridging theoretical insights and practical applications, Engineering Failure Analysis plays a pivotal role in shaping the future of engineering standards and safety practices.

INFORMACIJE MIDEM - JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS is a prominent open-access journal published by SOC MICROELECTRONICS, ELECTRON COMPONENTS MATERIALS-MIDEM in Slovenia, dedicated to advancing knowledge in the fields of microelectronics, electronic components, and materials. Since its inception in 1988, the journal has provided a platform for groundbreaking research and innovations, ensuring that all published work is freely accessible to a global audience. With an impressive history of publication from 1996 to 2024, INFORMACIJE MIDEM is indexed in Scopus, holding respectable ranks in categories such as Electrical and Electronic Engineering (Rank #525/797, Percentile 34th) and Electronic, Optical, and Magnetic Materials (Rank #204/284, Percentile 28th). While currently classified in the Q4 quartile for the year 2023, the journal serves as an essential resource for researchers, professionals, and students seeking the latest developments in microelectronics and related fields, fostering a collaborative academic environment and contributing to the advancement of technology and materials science.

PROGRESS IN PHOTOVOLTAICS, published by Wiley, is a leading scholarly journal dedicated to the advancement of photovoltaic technology and its applications. Since its inception in 1993, this journal has maintained a strong focus on the latest developments in solar energy, addressing both theoretical and practical aspects of photovoltaic systems. With an impressive impact factor and consistently ranked in the Q1 quartile across four key categories—Condensed Matter Physics, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, and Renewable Energy, Sustainability, and the Environment—PROGRESS IN PHOTOVOLTAICS is regarded as a pillar of scholarly excellence. The journal is essential for researchers, professionals, and students who seek to stay at the forefront of innovations and sustainability in the energy sector. Although it does not primarily offer open access, its commitment to advancing the understanding of photovoltaic technologies ensures that readers can expect high-quality, peer-reviewed research that pushes the boundaries of current knowledge.

SOLDERING & SURFACE MOUNT TECHNOLOGY is a prominent peer-reviewed journal published by Emerald Group Publishing Ltd in the United Kingdom, showcasing its commitment to advancing the fields of Electrical and Electronic Engineering, Condensed Matter Physics, and Materials Science. With a strong publication history dating back to 1989 and continuing through 2024, this journal provides a vital platform for disseminating innovative research and technological developments in soldering and surface mount technology. It holds a respectable ranking within its categories, including a Q3 classification in multiple fields according to the 2023 category quartiles, with Scopus rankings reflecting its growing influence in the academic community (e.g., #316/797 in Electrical and Electronic Engineering). While this journal does not offer open access, it remains an essential resource for researchers, practitioners, and students who aim to stay informed about cutting-edge advancements and trends in this dynamic area of study. By focusing on high-quality research contributions, SOLDERING & SURFACE MOUNT TECHNOLOGY continues to play a crucial role in fostering innovation and knowledge exchange within its scope.

MICROELECTRONICS JOURNAL, published by Elsevier Sci Ltd since 1974, serves as a pivotal platform for disseminating cutting-edge research in the realms of microelectronics, nanotechnology, and materials science. With editions spanning from 1974 to 2024, the journal is well-respected within the scientific community, boasting a strong presence in key categories such as Atomic and Molecular Physics, Condensed Matter Physics, and Electrical and Electronic Engineering, as evidenced by its Q3 ranking in 2023. Researchers and professionals engaged in the exploration of electronic materials, optical applications, and nanoscale innovations can greatly benefit from the journal's insights, which situate their work within a robust academic framework. Although the journal does not currently offer open access, its rigorous peer-review process and high visibility in Scopus rankings—including a percentile ranking of 58th in Condensed Matter Physics—make it an essential resource for anyone looking to stay at the forefront of advancements in microelectronics and related fields.

ASCE-ASME Journal of Risk and Uncertainty in Engineering Systems Part B-Mechanical Engineering, published by the reputable ASME, is a leading platform dedicated to advancing knowledge in the field of mechanical engineering with a particular emphasis on risk assessment and uncertainty analysis. With an ISSN of 2332-9017 and an E-ISSN of 2332-9025, this journal has established itself as a significant contributor to ongoing research in safety, risk, and reliability, consistently ranking in the Q2 quartile for Mechanical Engineering as well as Safety Research categories. As evidenced by its impressive Scopus rankings—including a notable 80th percentile in Safety Research—this journal fosters high-quality research that informs engineering practices and enhances safety protocols. Operating under a traditional access model, it aims to provide researchers, professionals, and students with essential insights and methodologies to address contemporary challenges in engineering systems. Each contribution reflects an aim to bridge theory and application, thus making the journal an invaluable resource for stakeholders striving for excellence in mechanical engineering and safety management.

Journal of Failure Analysis and Prevention, published by SpringerNature, stands as a vital resource in the fields of Materials Science, Mechanical Engineering, and Safety, Risk, Reliability and Quality. With an ISSN of 1547-7029 and an E-ISSN of 1864-1245, this journal has been dedicated to advancing the understanding of failure mechanisms and prevention strategies since its inception in 2001. Its convergence of rigorous research from various domains underscores its importance, achieving a Q3 classification across multiple engineering categories as of 2023. As of the latest rankings, it holds significant positions, including #114 in Safety, Risk, Reliability and Quality and #408 in Mechanical Engineering, illustrating its role in fostering scholarly dialogue and innovation. Although it does not currently offer open-access options, the journal endeavors to be accessible for researchers and professionals seeking impactful, high-quality analyses that inform both safety practices and engineering improvements. Whether you are a researcher pushing the boundaries of knowledge or a professional applying these principles, the Journal of Failure Analysis and Prevention is an indispensable part of your academic toolkit.

SOLID-STATE ELECTRONICS, published by Pergamon-Elsevier Science Ltd, is a highly regarded journal committed to advancing the field of solid-state physics and its applications. With an ISSN of 0038-1101 and an E-ISSN of 1879-2405, this journal has been a cornerstone of scholarly communication since its inception in 1960. Covering a rich spectrum of topics, it features in the Q3 category for Condensed Matter Physics, Electrical and Electronic Engineering, and Materials Science, reflecting its robust engagement in these critical fields. Despite not being an open-access journal, it provides valuable insights and research findings accessible to both academia and industry professionals, ensuring the dissemination of cutting-edge knowledge. With a strong focus on empirical research and theoretical developments, SOLID-STATE ELECTRONICS aims to bridge the gap between fundamental science and practical application, making it an essential resource for researchers, professionals, and students alike in the United Kingdom and beyond.

The International Journal of Rotating Machinery, published by Hindawi Ltd, is a prominent open-access journal dedicated to advancing research and innovation in the fields of Mechanical Engineering and Industrial and Manufacturing Engineering. Since its inception in 1994, the journal has been committed to disseminating high-quality research articles that explore the mechanics, performance, and design of rotating machinery, which are critical in various industrial applications. The journal has established itself within the academic community, earning a Q3 category ranking in both its specialized fields as of 2023. With a robust history spanning converged years from 1994 to 2024, and an active presence in major indexing databases, it serves as an essential resource for researchers, practitioners, and students keen to stay at the forefront of engineering advancements. Notably, the journal's open access policy ensures that all articles are freely available, fostering greater collaboration and sharing of knowledge within the global engineering community.