Engineering Failure Analysis is a prestigious peer-reviewed journal published by PERGAMON-ELSEVIER SCIENCE LTD, dedicated to advancing the field of engineering through comprehensive investigations into the causes and consequences of failures in various engineering domains. Established in 1994, the journal has become a cornerstone of knowledge in sectors such as Aerospace, Automotive, and Materials Science, earning its place within the Q1 quartile across multiple relevant categories in 2023. With a broad scope that encompasses topics related to safety, risk, reliability, and quality, it serves as a vital resource for researchers, professionals, and students keen on understanding how to mitigate failures and improve engineering practices. Although this journal does not currently offer Open Access, its impact is underscored by its high Scopus ranking, where it sits comfortably in the 36th position out of 307 in General Engineering. By bridging theoretical insights and practical applications, Engineering Failure Analysis plays a pivotal role in shaping the future of engineering standards and safety practices.

METALURGIJA is a distinguished open-access journal published by the Croatian Metallurgical Society, dedicated to advancing the field of metallurgical sciences and engineering. With an ISSN of 0543-5846 and E-ISSN of 1334-2576, this journal has been serving the academic community since its inception, offering valuable insights into condensed matter physics, materials chemistry, mechanics of materials, and metals and alloys. As of 2023, it ranks in Q3 in the fields of condensed matter physics, materials chemistry, and mechanics of materials, and Q2 in metals and alloys, reflecting its engagement with contemporary research and emerging trends. The journal's open-access policy, in place since 2002, ensures that high-quality research is accessible to a global audience, fostering collaboration and knowledge sharing. Located in Zagreb, Croatia, METALURGIJA aims to bring together researchers, industry professionals, and students alike to contribute to systemic advancements in metallurgical research and applications, ultimately enhancing innovation within the materials science community.

Bridge Structures is an esteemed academic journal dedicated to the field of structural engineering, particularly focusing on the design, analysis, and maintenance of bridge systems. Published by IOS PRESS, a reputable publisher known for its contributions to various scientific fields, the journal serves as an integral platform for disseminating innovative research and advancements within the domain. With an ISSN of 1573-2487 and an E-ISSN of 1744-8999, Bridge Structures has established itself over the years—covering contributions from 2005 to 2024. The journal has attained a commendable ranking within the Q3 category in Building and Construction and holds a position within the 28th percentile among its peers according to the Scopus rankings. Though the journal operates on a subscription basis, its commitment to advancing engineering knowledge is paramount, making it essential reading for researchers, practitioners, and students eager to deepen their understanding of bridge engineering. The journal not only explores theoretical advancements but also emphasizes practical applications, providing a well-rounded perspective on current challenges and solutions in the field of bridge structures.

Nondestructive Testing and Evaluation, published by Taylor & Francis Ltd, is a premier international journal dedicated to the dissemination of innovative research and practices in the field of nondestructive testing and evaluation. With a robust ISSN of 1058-9759 and an E-ISSN of 1477-2671, this journal has consistently served as a vital resource for researchers, professionals, and students interested in enhancing the safety and reliability of materials and structures through advanced testing techniques. The journal's significant impact, evidenced by its Q2 rankings across multiple categories—including Materials Science, Mechanical Engineering, and Physics and Astronomy, along with commendable Scopus rankings—reflects its commitment to high-quality scholarship. Covering the convergence of research from 1989 to 2024, Nondestructive Testing and Evaluation plays a crucial role in advancing methodologies that drive innovation in various engineering disciplines. While currently not offering an Open Access option, the journal remains a respected platform for exchanging knowledge that shapes the future of nondestructive methodologies.

MICROELECTRONICS INTERNATIONAL is a distinguished peer-reviewed journal published by Emerald Group Publishing Ltd, focusing on the expansive domains of microelectronics, materials science, and physics. With its ISSN 1356-5362 and E-ISSN 1758-812X, the journal has been a critical platform for researchers since its inception in 1982. Although it currently holds a Q4 category ranking across multiple disciplines such as Atomic and Molecular Physics, Electronic Engineering, and Surfaces, Coatings and Films, it remains committed to advancing scholarship and fostering dialogue within these fields. The journal's scope encompasses innovative research and developments that contribute to the understanding and technological evolution of microelectronic materials and systems. While it doesn't offer open access, its content is accessible through various academic databases, enabling a broad audience of professionals and enthusiasts to engage with high-quality research findings. As microelectronics continues to play a pivotal role in shaping modern technology, MICROELECTRONICS INTERNATIONAL serves as an essential resource for advancing knowledge and inspiring future innovations.

IEEE Journal of the Electron Devices Society is a premier open-access publication dedicated to the advancement of knowledge in the field of electron devices. Published by the IEEE Institute of Electrical and Electronics Engineers Inc, this journal has been contributing essential research to the scientific community since 2013, reflecting its commitment to fostering innovation and development in the industry. With a notable impact factor that places it in reputable category quartiles—Q3 in Biotechnology and Q2 in both Electrical and Electronic Engineering and Electronic, Optical, and Magnetic Materials—this journal stands as a respected outlet for cutting-edge studies. Positioned among the top-ranked journals in its respective categories, including a Scopus rank of #90 in Electronic, Optical and Magnetic Materials, it serves as a vital resource for researchers, professionals, and students alike. The open-access model enhances the journal's accessibility, allowing for widespread dissemination of crucial findings and innovations in electron device technologies. Whether you are engaged in academia or industry, the IEEE Journal of the Electron Devices Society is essential for remaining at the forefront of advancements in this dynamic field.

MICROELECTRONICS RELIABILITY, published by PERGAMON-ELSEVIER SCIENCE LTD, is a pivotal journal that serves the advancing field of microelectronics and materials reliability. With its ISSN 0026-2714 and E-ISSN 1872-941X, this journal has been at the forefront of disseminating research since its inception in 1962 and is set to continue exploring cutting-edge topics through 2024. The journal holds a respectable presence across several categories, achieving a Q3 ranking in areas such as Atomic and Molecular Physics and Electrical and Electronic Engineering, highlighting its broad interdisciplinary appeal, while also ranking in the Q2 category for Safety, Risk, Reliability, and Quality, which speaks to its commitment to ensuring standards in technological advancements. Access to this journal is subscription-based, making it an essential resource for researchers, professionals, and students seeking reliable information and data regarding electronic material performance and reliability assessment. Located in Kidlington, Oxford, UK, MICROELECTRONICS RELIABILITY is dedicated to advancing the field and addressing the critical issues associated with the reliability of microelectronic devices, thereby supporting innovations that shape our technological future.

Materials Performance and Characterization is a distinguished journal published by the American Society for Testing and Materials (ASTM), specializing in the field of materials science. With ISSN 2379-1365 and E-ISSN 2165-3992, this journal serves as a pivotal platform for disseminating innovative research in the areas of metals and alloys, polymers and plastics, ceramics and composites, and mechanics of materials. Established in 2012, it continues to feature peer-reviewed articles that contribute to both theoretical advancements and practical applications, emphasizing the importance of materials performance in various industries. Despite its current Q4 and Q3 rankings across categories as of 2023, the journal is committed to enhancing its influence in the materials science community, fostering engagement among researchers, professionals, and students alike. The journal is essential for anyone seeking to stay at the forefront of materials research and characterization.

IEEE Electronics Device Letters, published by the esteemed IEEE-Institute of Electrical and Electronics Engineers Inc, stands at the forefront of innovation in the field of electrical and electronic engineering. With a rich history spanning from 1980 to 2024, this journal showcases groundbreaking research and letters that significantly contribute to the advancement of electronic, optical, and magnetic materials. Its impressive Q1 rankings in both Electrical and Electronic Engineering and Electronic, Optical, and Magnetic Materials underscore its pivotal role in shaping contemporary academic discourse. The journal maintains a strong position in Scopus rankings, positioned within the top 16% for Electrical and Electronic Engineering and the top 18% for Materials Science, making it a vital resource for researchers, professionals, and students alike. With the absence of open access, it maintains an exclusive repository of high-impact research that experts in the field turn to for the latest insights and developments. IEEE Electronics Device Letters is committed to providing a platform for the dissemination of transformative knowledge that fuels innovation and progress in the ever-evolving landscape of electronics.

Integration - The VLSI Journal, published by Elsevier, stands as a significant contributor to the fields of Electrical and Electronic Engineering, Hardware and Architecture, and Software. With its ISSN 0167-9260 and E-ISSN 1872-7522, this journal caters to a global audience interested in cutting-edge research and advancements in Very Large Scale Integration (VLSI) technologies and methodologies. As of 2023, the journal is classified in the Q3 category in its respective fields, demonstrating its commitment to quality and relevance in engineering. Researchers, practitioners, and students can benefit from its rigorous peer-review process, which ensures the publication of high-impact studies and innovative findings within the engineering landscape. Boasting a converged history from 1983 to 2025, Integration - The VLSI Journal continues to foster scholarly exchange and collaboration, making it an essential resource for anyone aiming to stay at the forefront of VLSI research.