The Japanese Journal of Applied Physics is a premier publication in the field of applied physics, offering a platform for researchers and professionals to present their findings and innovations. Published by IOP Publishing Ltd, this esteemed journal has been active since 1963 and continues to contribute significantly to the understanding and advancement of applied physics across diverse applications. The journal is recognized for its rigorous peer-review process and high-quality publications, evidenced by its 2023 ranking of Q2 in Engineering (Miscellaneous) and Q3 in Physics and Astronomy (Miscellaneous). With an accessible ISSN of 0021-4922 and E-ISSN 1347-4065, the journal cultivates a global readership, fostering collaboration and innovation within the scientific community. Although the journal does not currently offer open access options, its valuable insights into the latest technological advancements and theoretical developments remain crucial for students, researchers, and industry professionals alike. By bridging the gap between fundamental physics and practical applications, the Japanese Journal of Applied Physics plays a vital role in shaping the future of applied sciences in Japan and beyond.

MICROELECTRONICS RELIABILITY, published by PERGAMON-ELSEVIER SCIENCE LTD, is a pivotal journal that serves the advancing field of microelectronics and materials reliability. With its ISSN 0026-2714 and E-ISSN 1872-941X, this journal has been at the forefront of disseminating research since its inception in 1962 and is set to continue exploring cutting-edge topics through 2024. The journal holds a respectable presence across several categories, achieving a Q3 ranking in areas such as Atomic and Molecular Physics and Electrical and Electronic Engineering, highlighting its broad interdisciplinary appeal, while also ranking in the Q2 category for Safety, Risk, Reliability, and Quality, which speaks to its commitment to ensuring standards in technological advancements. Access to this journal is subscription-based, making it an essential resource for researchers, professionals, and students seeking reliable information and data regarding electronic material performance and reliability assessment. Located in Kidlington, Oxford, UK, MICROELECTRONICS RELIABILITY is dedicated to advancing the field and addressing the critical issues associated with the reliability of microelectronic devices, thereby supporting innovations that shape our technological future.

IEEE Journal of the Electron Devices Society is a premier open-access publication dedicated to the advancement of knowledge in the field of electron devices. Published by the IEEE Institute of Electrical and Electronics Engineers Inc, this journal has been contributing essential research to the scientific community since 2013, reflecting its commitment to fostering innovation and development in the industry. With a notable impact factor that places it in reputable category quartiles—Q3 in Biotechnology and Q2 in both Electrical and Electronic Engineering and Electronic, Optical, and Magnetic Materials—this journal stands as a respected outlet for cutting-edge studies. Positioned among the top-ranked journals in its respective categories, including a Scopus rank of #90 in Electronic, Optical and Magnetic Materials, it serves as a vital resource for researchers, professionals, and students alike. The open-access model enhances the journal's accessibility, allowing for widespread dissemination of crucial findings and innovations in electron device technologies. Whether you are engaged in academia or industry, the IEEE Journal of the Electron Devices Society is essential for remaining at the forefront of advancements in this dynamic field.

Transactions on Electrical and Electronic Materials, published by Springer, is a distinguished journal aimed at advancing the fields of electrical and electronic engineering, as well as electronic, optical, and magnetic materials. With an ISSN of 1229-7607 and an E-ISSN of 2092-7592, this journal is vital in disseminating impactful research and innovations, providing insights and significant findings that cater to both academia and industry. Holding a Q3 ranking in the categories of Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, it serves as a reputable platform for sharing research that influences ongoing developments in these critical areas. The journal's converged years from 2011 to 2024 signify its commitment to providing a comprehensive review of technological advancements. Located in New York City, it appeals to a global audience of researchers, professionals, and students, enhancing their understanding of current trends and practices within the domain.

RELIABILITY ENGINEERING & SYSTEM SAFETY is a leading interdisciplinary journal published by Elsevier Sci Ltd, dedicated to advancing knowledge in the fields of applied mathematics, industrial and manufacturing engineering, and safety, risk, reliability, and quality. With a significant presence since its inception in 1983, this esteemed journal, identifiable by ISSN 0951-8320 and E-ISSN 1879-0836, holds an impressive impact factor and ranks in the top quartile (Q1) of its categories according to the most recent metrics. Specifically, it has achieved remarkable standings in Scopus, ranking #3 out of 207 in Safety, Risk, Reliability and Quality, marking it in the 98th percentile, and #21 out of 384 in Industrial and Manufacturing Engineering, at the 94th percentile. This distinction underscores the journal's vital role in shaping research and innovation in its fields. While it does not operate under an open access model, RELIABILITY ENGINEERING & SYSTEM SAFETY remains an essential resource for researchers, professionals, and students, aiming to publish high-quality articles that facilitate the understanding and application of reliability engineering and systemic safety within various industrial contexts. Stay ahead in cutting-edge research by engaging with the latest articles and findings from this influential journal.

The Journal of Semiconductor Technology and Science, published by the IEEK PUBLICATION CENTER, serves as a vital platform for advancing the field of semiconductor technology and materials science. With its ISSN 1598-1657 and E-ISSN 2233-4866, this journal has been pivotal since its inception in 2005, continuing to shed light on innovative research until 2024. Although currently classified in the Q4 category for both Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, it remains a crucial resource for those in industry and academia alike, providing in-depth analyses and findings that explore the complexities of semiconductor applications. Researchers and professionals will find value in its comprehensive articles that address current trends and future directions in semiconductor technologies. This open-access journal, published in South Korea, is positioned to foster collaboration among students, professionals, and leading researchers in the ever-evolving technology landscape.

The Journal of Structural Fire Engineering is a premier academic publication dedicated to advancing the field of fire safety and structural engineering. Published by Emerald Group Publishing Ltd, this journal features high-quality research and innovative solutions addressing crucial aspects of safety, risk, reliability, and the mechanics of materials. With an impact factor that reflects its growing influence in the academic community and a classification in the Q3 quartile across several engineering categories, the journal plays a vital role in disseminating knowledge that bridges theoretical concepts and practical applications. With coverage spanning from 2010 to 2024, researchers, professionals, and students can access a wealth of studies that explore the intersection of structural integrity and fire safety. While it currently operates under a subscription model, the journal remains committed to sharing pivotal insights that drive forward the discipline. Join the community of experts striving to enhance engineering practices and resilience against fire-related hazards.

Structures is a premier interdisciplinary journal published by Elsevier Science Inc, dedicated to advancing the fields of architecture, building and construction, civil and structural engineering, and safety, risk, reliability, and quality. With its ISSN 2352-0124, this scholarly journal showcases cutting-edge research and innovative practices that drive the evolution of structural design and analysis. Since its establishment in 2015, Structures has swiftly garnered high esteem, achieving a Q1 ranking in four key categories as of 2023, and placing within the top percentiles in various engineering disciplines, making it an essential resource for industry professionals, researchers, and students alike. The journal promotes a comprehensive understanding of contemporary challenges and solutions within its scope, providing a platform for disseminating impactful research. Access options may vary, but the commitment to high-quality, peer-reviewed content remains a constant in fostering academic growth and industry advancement.

Nondestructive Testing and Evaluation, published by Taylor & Francis Ltd, is a premier international journal dedicated to the dissemination of innovative research and practices in the field of nondestructive testing and evaluation. With a robust ISSN of 1058-9759 and an E-ISSN of 1477-2671, this journal has consistently served as a vital resource for researchers, professionals, and students interested in enhancing the safety and reliability of materials and structures through advanced testing techniques. The journal's significant impact, evidenced by its Q2 rankings across multiple categories—including Materials Science, Mechanical Engineering, and Physics and Astronomy, along with commendable Scopus rankings—reflects its commitment to high-quality scholarship. Covering the convergence of research from 1989 to 2024, Nondestructive Testing and Evaluation plays a crucial role in advancing methodologies that drive innovation in various engineering disciplines. While currently not offering an Open Access option, the journal remains a respected platform for exchanging knowledge that shapes the future of nondestructive methodologies.

JOURNAL OF ELECTRONIC PACKAGING, published by the esteemed American Society of Mechanical Engineers (ASME), is a pivotal platform for research in the fields of Computer Science Applications, Electrical and Electronic Engineering, and Materials Science, particularly focusing on electronic packaging technologies. With an ISSN of 1043-7398 and an E-ISSN of 1528-9044, this journal has consistently showcased groundbreaking studies since its inception in 1989, projected to continue until 2025. Recognized within the Q2 quartile rankings across multiple categories in the 2023 Scopus rankings, it maintains a strong presence in the academic community with notable rankings in various engineering and materials science domains. This journal serves as a critical resource for researchers, professionals, and students who seek to advance their understanding and application of innovative electronic packaging solutions. Though it does not offer open access, it encompasses a robust array of high-quality articles that foster knowledge advancement and interdisciplinary collaboration in a rapidly evolving technological landscape, ultimately contributing to the growth and sophistication of the electronic packaging field.