QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL is a prestigious journal published by WILEY, dedicated to advancing the fields of quality, reliability, and engineering. With an ISSN of 0748-8017 and an E-ISSN of 1099-1638, this journal provides a platform for scholarly articles that delve into the intricacies of management science, operations research, safety, risk, reliability, and quality, as evidenced by its strong ranking in the Q2 category for both Management Science and Operations Research, as well as Safety, Risk, Reliability, and Quality. Established in 1985 and continuing through 2024, the journal has garnered a solid reputation in the academic community, achieving a Scopus ranking in the 70th and 64th percentiles for its respective categories. Although it does not offer open access, its authoritative content is essential for researchers, professionals, and students seeking to deepen their understanding of quality and reliability principles. With its UK-based publishing address ensuring global reach, this journal remains at the forefront of discussions surrounding engineering quality and reliability methodologies.

The Journal of Semiconductor Technology and Science, published by the IEEK PUBLICATION CENTER, serves as a vital platform for advancing the field of semiconductor technology and materials science. With its ISSN 1598-1657 and E-ISSN 2233-4866, this journal has been pivotal since its inception in 2005, continuing to shed light on innovative research until 2024. Although currently classified in the Q4 category for both Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, it remains a crucial resource for those in industry and academia alike, providing in-depth analyses and findings that explore the complexities of semiconductor applications. Researchers and professionals will find value in its comprehensive articles that address current trends and future directions in semiconductor technologies. This open-access journal, published in South Korea, is positioned to foster collaboration among students, professionals, and leading researchers in the ever-evolving technology landscape.

The International Journal of Reliability Quality and Safety Engineering, published by World Scientific Publishing Co Pte Ltd, is a leading platform for disseminating cutting-edge research in the fields of reliability, quality, and safety engineering. With an impressive scope that spans across aerospace, electrical engineering, nuclear energy, and industrial manufacturing, this journal serves as a critical resource for researchers and professionals aiming to enhance system dependability and operational excellence. Indexed in Scopus, it holds a respectable Q3 ranking across various categories in 2023, reflecting its growing influence in the academic community. Although currently not open access, it provides ample opportunities for scholars to publish impactful studies from its extensive database, which has evolved since 1996. The journal's commitment to advancing knowledge in reliability and safety engineering makes it a pivotal resource for those dedicated to improving engineering practices and protocols worldwide.

IEEE Journal of the Electron Devices Society is a premier open-access publication dedicated to the advancement of knowledge in the field of electron devices. Published by the IEEE Institute of Electrical and Electronics Engineers Inc, this journal has been contributing essential research to the scientific community since 2013, reflecting its commitment to fostering innovation and development in the industry. With a notable impact factor that places it in reputable category quartiles—Q3 in Biotechnology and Q2 in both Electrical and Electronic Engineering and Electronic, Optical, and Magnetic Materials—this journal stands as a respected outlet for cutting-edge studies. Positioned among the top-ranked journals in its respective categories, including a Scopus rank of #90 in Electronic, Optical and Magnetic Materials, it serves as a vital resource for researchers, professionals, and students alike. The open-access model enhances the journal's accessibility, allowing for widespread dissemination of crucial findings and innovations in electron device technologies. Whether you are engaged in academia or industry, the IEEE Journal of the Electron Devices Society is essential for remaining at the forefront of advancements in this dynamic field.

JOURNAL OF ELECTRONIC PACKAGING, published by the esteemed American Society of Mechanical Engineers (ASME), is a pivotal platform for research in the fields of Computer Science Applications, Electrical and Electronic Engineering, and Materials Science, particularly focusing on electronic packaging technologies. With an ISSN of 1043-7398 and an E-ISSN of 1528-9044, this journal has consistently showcased groundbreaking studies since its inception in 1989, projected to continue until 2025. Recognized within the Q2 quartile rankings across multiple categories in the 2023 Scopus rankings, it maintains a strong presence in the academic community with notable rankings in various engineering and materials science domains. This journal serves as a critical resource for researchers, professionals, and students who seek to advance their understanding and application of innovative electronic packaging solutions. Though it does not offer open access, it encompasses a robust array of high-quality articles that foster knowledge advancement and interdisciplinary collaboration in a rapidly evolving technological landscape, ultimately contributing to the growth and sophistication of the electronic packaging field.

IEEE Electronics Device Letters, published by the esteemed IEEE-Institute of Electrical and Electronics Engineers Inc, stands at the forefront of innovation in the field of electrical and electronic engineering. With a rich history spanning from 1980 to 2024, this journal showcases groundbreaking research and letters that significantly contribute to the advancement of electronic, optical, and magnetic materials. Its impressive Q1 rankings in both Electrical and Electronic Engineering and Electronic, Optical, and Magnetic Materials underscore its pivotal role in shaping contemporary academic discourse. The journal maintains a strong position in Scopus rankings, positioned within the top 16% for Electrical and Electronic Engineering and the top 18% for Materials Science, making it a vital resource for researchers, professionals, and students alike. With the absence of open access, it maintains an exclusive repository of high-impact research that experts in the field turn to for the latest insights and developments. IEEE Electronics Device Letters is committed to providing a platform for the dissemination of transformative knowledge that fuels innovation and progress in the ever-evolving landscape of electronics.

SOLID-STATE ELECTRONICS, published by Pergamon-Elsevier Science Ltd, is a highly regarded journal committed to advancing the field of solid-state physics and its applications. With an ISSN of 0038-1101 and an E-ISSN of 1879-2405, this journal has been a cornerstone of scholarly communication since its inception in 1960. Covering a rich spectrum of topics, it features in the Q3 category for Condensed Matter Physics, Electrical and Electronic Engineering, and Materials Science, reflecting its robust engagement in these critical fields. Despite not being an open-access journal, it provides valuable insights and research findings accessible to both academia and industry professionals, ensuring the dissemination of cutting-edge knowledge. With a strong focus on empirical research and theoretical developments, SOLID-STATE ELECTRONICS aims to bridge the gap between fundamental science and practical application, making it an essential resource for researchers, professionals, and students alike in the United Kingdom and beyond.

Materials Performance and Characterization is a distinguished journal published by the American Society for Testing and Materials (ASTM), specializing in the field of materials science. With ISSN 2379-1365 and E-ISSN 2165-3992, this journal serves as a pivotal platform for disseminating innovative research in the areas of metals and alloys, polymers and plastics, ceramics and composites, and mechanics of materials. Established in 2012, it continues to feature peer-reviewed articles that contribute to both theoretical advancements and practical applications, emphasizing the importance of materials performance in various industries. Despite its current Q4 and Q3 rankings across categories as of 2023, the journal is committed to enhancing its influence in the materials science community, fostering engagement among researchers, professionals, and students alike. The journal is essential for anyone seeking to stay at the forefront of materials research and characterization.

The Journal of Machinery Manufacture and Reliability, published by PLEIADES PUBLISHING INC, serves as a pivotal platform for advancing knowledge in the fields of Industrial and Manufacturing Engineering, Mechanical Engineering, and Safety, Risk, Reliability, and Quality. Having adopted an Open Access model since 2015, this journal facilitates global dissemination of research findings and innovations, ensuring that critical developments in machinery manufacture resonate across the academic and professional spectrum. With its ISSN 1052-6188 and E-ISSN 1934-9394, it has established itself within established quartiles, notably Q3 in key engineering categories according to the 2023 metrics. Its Scopus rankings underscore its emerging impact, though it remains an area for growth, making it an excellent venue for early-career researchers aiming to contribute to a growing body of literature. The journal's commitment to high-quality, accessible research positions it as a must-read for academics and practitioners alike, fostering innovation and collaboration in the machinery manufacturing sector.

Journal of Failure Analysis and Prevention, published by SpringerNature, stands as a vital resource in the fields of Materials Science, Mechanical Engineering, and Safety, Risk, Reliability and Quality. With an ISSN of 1547-7029 and an E-ISSN of 1864-1245, this journal has been dedicated to advancing the understanding of failure mechanisms and prevention strategies since its inception in 2001. Its convergence of rigorous research from various domains underscores its importance, achieving a Q3 classification across multiple engineering categories as of 2023. As of the latest rankings, it holds significant positions, including #114 in Safety, Risk, Reliability and Quality and #408 in Mechanical Engineering, illustrating its role in fostering scholarly dialogue and innovation. Although it does not currently offer open-access options, the journal endeavors to be accessible for researchers and professionals seeking impactful, high-quality analyses that inform both safety practices and engineering improvements. Whether you are a researcher pushing the boundaries of knowledge or a professional applying these principles, the Journal of Failure Analysis and Prevention is an indispensable part of your academic toolkit.