JOURNAL OF ELECTRONIC PACKAGING, published by the esteemed American Society of Mechanical Engineers (ASME), is a pivotal platform for research in the fields of Computer Science Applications, Electrical and Electronic Engineering, and Materials Science, particularly focusing on electronic packaging technologies. With an ISSN of 1043-7398 and an E-ISSN of 1528-9044, this journal has consistently showcased groundbreaking studies since its inception in 1989, projected to continue until 2025. Recognized within the Q2 quartile rankings across multiple categories in the 2023 Scopus rankings, it maintains a strong presence in the academic community with notable rankings in various engineering and materials science domains. This journal serves as a critical resource for researchers, professionals, and students who seek to advance their understanding and application of innovative electronic packaging solutions. Though it does not offer open access, it encompasses a robust array of high-quality articles that foster knowledge advancement and interdisciplinary collaboration in a rapidly evolving technological landscape, ultimately contributing to the growth and sophistication of the electronic packaging field.

The Journal of Semiconductor Technology and Science, published by the IEEK PUBLICATION CENTER, serves as a vital platform for advancing the field of semiconductor technology and materials science. With its ISSN 1598-1657 and E-ISSN 2233-4866, this journal has been pivotal since its inception in 2005, continuing to shed light on innovative research until 2024. Although currently classified in the Q4 category for both Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, it remains a crucial resource for those in industry and academia alike, providing in-depth analyses and findings that explore the complexities of semiconductor applications. Researchers and professionals will find value in its comprehensive articles that address current trends and future directions in semiconductor technologies. This open-access journal, published in South Korea, is positioned to foster collaboration among students, professionals, and leading researchers in the ever-evolving technology landscape.

The International Journal of Reliability Quality and Safety Engineering, published by World Scientific Publishing Co Pte Ltd, is a leading platform for disseminating cutting-edge research in the fields of reliability, quality, and safety engineering. With an impressive scope that spans across aerospace, electrical engineering, nuclear energy, and industrial manufacturing, this journal serves as a critical resource for researchers and professionals aiming to enhance system dependability and operational excellence. Indexed in Scopus, it holds a respectable Q3 ranking across various categories in 2023, reflecting its growing influence in the academic community. Although currently not open access, it provides ample opportunities for scholars to publish impactful studies from its extensive database, which has evolved since 1996. The journal's commitment to advancing knowledge in reliability and safety engineering makes it a pivotal resource for those dedicated to improving engineering practices and protocols worldwide.

The Journal of Machinery Manufacture and Reliability, published by PLEIADES PUBLISHING INC, serves as a pivotal platform for advancing knowledge in the fields of Industrial and Manufacturing Engineering, Mechanical Engineering, and Safety, Risk, Reliability, and Quality. Having adopted an Open Access model since 2015, this journal facilitates global dissemination of research findings and innovations, ensuring that critical developments in machinery manufacture resonate across the academic and professional spectrum. With its ISSN 1052-6188 and E-ISSN 1934-9394, it has established itself within established quartiles, notably Q3 in key engineering categories according to the 2023 metrics. Its Scopus rankings underscore its emerging impact, though it remains an area for growth, making it an excellent venue for early-career researchers aiming to contribute to a growing body of literature. The journal's commitment to high-quality, accessible research positions it as a must-read for academics and practitioners alike, fostering innovation and collaboration in the machinery manufacturing sector.

IEEE Journal of the Electron Devices Society is a premier open-access publication dedicated to the advancement of knowledge in the field of electron devices. Published by the IEEE Institute of Electrical and Electronics Engineers Inc, this journal has been contributing essential research to the scientific community since 2013, reflecting its commitment to fostering innovation and development in the industry. With a notable impact factor that places it in reputable category quartiles—Q3 in Biotechnology and Q2 in both Electrical and Electronic Engineering and Electronic, Optical, and Magnetic Materials—this journal stands as a respected outlet for cutting-edge studies. Positioned among the top-ranked journals in its respective categories, including a Scopus rank of #90 in Electronic, Optical and Magnetic Materials, it serves as a vital resource for researchers, professionals, and students alike. The open-access model enhances the journal's accessibility, allowing for widespread dissemination of crucial findings and innovations in electron device technologies. Whether you are engaged in academia or industry, the IEEE Journal of the Electron Devices Society is essential for remaining at the forefront of advancements in this dynamic field.

The Japanese Journal of Applied Physics is a premier publication in the field of applied physics, offering a platform for researchers and professionals to present their findings and innovations. Published by IOP Publishing Ltd, this esteemed journal has been active since 1963 and continues to contribute significantly to the understanding and advancement of applied physics across diverse applications. The journal is recognized for its rigorous peer-review process and high-quality publications, evidenced by its 2023 ranking of Q2 in Engineering (Miscellaneous) and Q3 in Physics and Astronomy (Miscellaneous). With an accessible ISSN of 0021-4922 and E-ISSN 1347-4065, the journal cultivates a global readership, fostering collaboration and innovation within the scientific community. Although the journal does not currently offer open access options, its valuable insights into the latest technological advancements and theoretical developments remain crucial for students, researchers, and industry professionals alike. By bridging the gap between fundamental physics and practical applications, the Japanese Journal of Applied Physics plays a vital role in shaping the future of applied sciences in Japan and beyond.

SOLID-STATE ELECTRONICS, published by Pergamon-Elsevier Science Ltd, is a highly regarded journal committed to advancing the field of solid-state physics and its applications. With an ISSN of 0038-1101 and an E-ISSN of 1879-2405, this journal has been a cornerstone of scholarly communication since its inception in 1960. Covering a rich spectrum of topics, it features in the Q3 category for Condensed Matter Physics, Electrical and Electronic Engineering, and Materials Science, reflecting its robust engagement in these critical fields. Despite not being an open-access journal, it provides valuable insights and research findings accessible to both academia and industry professionals, ensuring the dissemination of cutting-edge knowledge. With a strong focus on empirical research and theoretical developments, SOLID-STATE ELECTRONICS aims to bridge the gap between fundamental science and practical application, making it an essential resource for researchers, professionals, and students alike in the United Kingdom and beyond.

Engineering Failure Analysis is a prestigious peer-reviewed journal published by PERGAMON-ELSEVIER SCIENCE LTD, dedicated to advancing the field of engineering through comprehensive investigations into the causes and consequences of failures in various engineering domains. Established in 1994, the journal has become a cornerstone of knowledge in sectors such as Aerospace, Automotive, and Materials Science, earning its place within the Q1 quartile across multiple relevant categories in 2023. With a broad scope that encompasses topics related to safety, risk, reliability, and quality, it serves as a vital resource for researchers, professionals, and students keen on understanding how to mitigate failures and improve engineering practices. Although this journal does not currently offer Open Access, its impact is underscored by its high Scopus ranking, where it sits comfortably in the 36th position out of 307 in General Engineering. By bridging theoretical insights and practical applications, Engineering Failure Analysis plays a pivotal role in shaping the future of engineering standards and safety practices.

IEEE Design & Test is a leading academic journal published by the IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, dedicated to advancing the fields of Electrical and Electronic Engineering, Hardware and Architecture, and Software. With an ISSN of 2168-2356 and an E-ISSN of 2168-2364, the journal spans from 2013 to 2024, offering valuable insights and peer-reviewed research that addresses critical challenges in the design, verification, and testing of electronic systems. Recognized for its quality, the journal holds a Q2 designation in Electrical and Electronic Engineering and ranks within the top quartiles of its category, making it a notable resource for professionals and scholars alike. Its Scopus rankings, particularly a rank of #354 in Electrical and Electronic Engineering, underscores its significance and relevance in the rapidly evolving technological landscape. Although not currently open access, the journal remains committed to disseminating innovative research that shapes the future of technology, ensuring that researchers and practitioners stay at the forefront of their disciplines. IEEE Design & Test serves as an essential platform for exchanging ideas, fostering collaboration, and driving advancements in engineering and computer science.

MICROELECTRONICS INTERNATIONAL is a distinguished peer-reviewed journal published by Emerald Group Publishing Ltd, focusing on the expansive domains of microelectronics, materials science, and physics. With its ISSN 1356-5362 and E-ISSN 1758-812X, the journal has been a critical platform for researchers since its inception in 1982. Although it currently holds a Q4 category ranking across multiple disciplines such as Atomic and Molecular Physics, Electronic Engineering, and Surfaces, Coatings and Films, it remains committed to advancing scholarship and fostering dialogue within these fields. The journal's scope encompasses innovative research and developments that contribute to the understanding and technological evolution of microelectronic materials and systems. While it doesn't offer open access, its content is accessible through various academic databases, enabling a broad audience of professionals and enthusiasts to engage with high-quality research findings. As microelectronics continues to play a pivotal role in shaping modern technology, MICROELECTRONICS INTERNATIONAL serves as an essential resource for advancing knowledge and inspiring future innovations.