IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Scope & Guideline

Exploring Innovations in Device and Material Reliability for a Sustainable Future.

Introduction

Welcome to the IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY information hub, where our guidelines provide a wealth of knowledge about the journal’s focus and academic contributions. This page includes an extensive look at the aims and scope of IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, highlighting trending and emerging areas of study. We also examine declining topics to offer insight into academic interest shifts. Our curated list of highly cited topics and recent publications is part of our effort to guide scholars, using these guidelines to stay ahead in their research endeavors.
LanguageEnglish
ISSN1530-4388
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Support Open AccessNo
CountryUnited States
TypeJournal
Convergefrom 2001 to 2024
AbbreviationIEEE T DEVICE MAT RE / IEEE Trans. Device Mater. Reliab.
Frequency4 issues/year
Time To First Decision-
Time To Acceptance-
Acceptance Rate-
Home Page-
Address445 HOES LANE, PISCATAWAY, NJ 08855-4141

Aims and Scopes

The IEEE Transactions on Device and Materials Reliability focuses on the reliability and performance of electronic devices and materials. It encompasses a wide range of topics related to the assessment, modeling, and enhancement of reliability in semiconductor devices and materials used in electronic applications.
  1. Device Reliability Assessment:
    The journal emphasizes methodologies for assessing the reliability of various electronic devices, including semiconductors and integrated circuits, under different operational and environmental conditions.
  2. Material Reliability and Aging:
    Research on the aging mechanisms and reliability of materials used in electronic devices, including dielectrics, metals, and semiconductors, is a core focus.
  3. Failure Mechanisms and Modeling:
    The journal includes studies on identifying and modeling failure mechanisms in electronic devices, such as hot carrier degradation, time-dependent dielectric breakdown (TDDB), and thermal effects.
  4. Innovative Reliability Enhancement Techniques:
    Papers often present innovative techniques and technologies aimed at improving the reliability of devices, including design modifications and new material applications.
  5. Impact of Environmental Factors:
    Research exploring the impact of environmental factors such as radiation, temperature, and humidity on device reliability is a critical area of focus.
  6. Advanced Testing and Characterization Methods:
    The journal publishes work on new testing methods and characterization techniques that provide insights into the reliability and performance of devices.
The journal has identified several trending and emerging themes that highlight the evolving landscape of device reliability research. These themes are increasingly relevant in the context of advancing technologies and materials.
  1. Advanced Semiconductor Technologies:
    There is a growing focus on the reliability of advanced semiconductor technologies, such as GaN and SiC devices, which are essential for high-performance applications.
  2. Machine Learning and AI in Reliability Prediction:
    The integration of machine learning and artificial intelligence for predictive modeling and reliability assessment is an emerging theme, reflecting the industry's shift towards data-driven approaches.
  3. Flexible and Wearable Electronics:
    Research on the reliability of flexible and wearable electronics is gaining traction, driven by the demand for innovative applications in consumer electronics and medical devices.
  4. 3D Integration and Packaging Reliability:
    As 3D integration techniques become more prevalent, studies addressing the reliability challenges associated with these advanced packaging methods are increasingly important.
  5. Environmental and Radiation Effects:
    Research examining the impact of environmental factors and radiation on device performance and reliability is trending, especially in applications related to space and military technologies.
  6. Sustainability and Eco-Friendly Materials:
    An emerging theme involves the exploration of sustainable and eco-friendly materials in device fabrication, focusing on their reliability and performance.

Declining or Waning

While the journal continuously evolves, certain themes have shown a decline in publication frequency over recent years. These waning scopes reflect shifts in research priorities and emerging technologies.
  1. Traditional Reliability Testing:
    There has been a noticeable decrease in papers focused solely on traditional reliability testing methods, as newer and more sophisticated testing techniques gain prominence.
  2. Basic Device Characterization:
    Research centered on basic characterization of devices without a strong emphasis on reliability implications is less frequent, as the field moves towards more application-oriented studies.
  3. Lower Technology Node Devices:
    As the focus shifts towards advanced materials and devices, there is a decline in studies specifically targeting lower technology nodes, which were once a major area of interest.
  4. Generalized Failure Analysis:
    Papers providing generalized failure analysis without specific context or application to current technologies have become less common, as more targeted studies emerge.

Similar Journals

IEEE Design & Test

Pioneering Insights in Electronic System Design
Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCISSN: 2168-2356Frequency: 6 issues/year

IEEE Design & Test is a leading academic journal published by the IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, dedicated to advancing the fields of Electrical and Electronic Engineering, Hardware and Architecture, and Software. With an ISSN of 2168-2356 and an E-ISSN of 2168-2364, the journal spans from 2013 to 2024, offering valuable insights and peer-reviewed research that addresses critical challenges in the design, verification, and testing of electronic systems. Recognized for its quality, the journal holds a Q2 designation in Electrical and Electronic Engineering and ranks within the top quartiles of its category, making it a notable resource for professionals and scholars alike. Its Scopus rankings, particularly a rank of #354 in Electrical and Electronic Engineering, underscores its significance and relevance in the rapidly evolving technological landscape. Although not currently open access, the journal remains committed to disseminating innovative research that shapes the future of technology, ensuring that researchers and practitioners stay at the forefront of their disciplines. IEEE Design & Test serves as an essential platform for exchanging ideas, fostering collaboration, and driving advancements in engineering and computer science.

Nondestructive Testing and Evaluation

Innovative Insights for Safer Structures and Materials
Publisher: TAYLOR & FRANCIS LTDISSN: 1058-9759Frequency: 8 issues/year

Nondestructive Testing and Evaluation, published by Taylor & Francis Ltd, is a premier international journal dedicated to the dissemination of innovative research and practices in the field of nondestructive testing and evaluation. With a robust ISSN of 1058-9759 and an E-ISSN of 1477-2671, this journal has consistently served as a vital resource for researchers, professionals, and students interested in enhancing the safety and reliability of materials and structures through advanced testing techniques. The journal's significant impact, evidenced by its Q2 rankings across multiple categories—including Materials Science, Mechanical Engineering, and Physics and Astronomy, along with commendable Scopus rankings—reflects its commitment to high-quality scholarship. Covering the convergence of research from 1989 to 2024, Nondestructive Testing and Evaluation plays a crucial role in advancing methodologies that drive innovation in various engineering disciplines. While currently not offering an Open Access option, the journal remains a respected platform for exchanging knowledge that shapes the future of nondestructive methodologies.

QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL

Advancing the Frontiers of Quality and Reliability Engineering
Publisher: WILEYISSN: 0748-8017Frequency: 8 issues/year

QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL is a prestigious journal published by WILEY, dedicated to advancing the fields of quality, reliability, and engineering. With an ISSN of 0748-8017 and an E-ISSN of 1099-1638, this journal provides a platform for scholarly articles that delve into the intricacies of management science, operations research, safety, risk, reliability, and quality, as evidenced by its strong ranking in the Q2 category for both Management Science and Operations Research, as well as Safety, Risk, Reliability, and Quality. Established in 1985 and continuing through 2024, the journal has garnered a solid reputation in the academic community, achieving a Scopus ranking in the 70th and 64th percentiles for its respective categories. Although it does not offer open access, its authoritative content is essential for researchers, professionals, and students seeking to deepen their understanding of quality and reliability principles. With its UK-based publishing address ensuring global reach, this journal remains at the forefront of discussions surrounding engineering quality and reliability methodologies.

MICROELECTRONICS INTERNATIONAL

Shaping tomorrow's technology with today's research.
Publisher: EMERALD GROUP PUBLISHING LTDISSN: 1356-5362Frequency: 3 issues/year

MICROELECTRONICS INTERNATIONAL is a distinguished peer-reviewed journal published by Emerald Group Publishing Ltd, focusing on the expansive domains of microelectronics, materials science, and physics. With its ISSN 1356-5362 and E-ISSN 1758-812X, the journal has been a critical platform for researchers since its inception in 1982. Although it currently holds a Q4 category ranking across multiple disciplines such as Atomic and Molecular Physics, Electronic Engineering, and Surfaces, Coatings and Films, it remains committed to advancing scholarship and fostering dialogue within these fields. The journal's scope encompasses innovative research and developments that contribute to the understanding and technological evolution of microelectronic materials and systems. While it doesn't offer open access, its content is accessible through various academic databases, enabling a broad audience of professionals and enthusiasts to engage with high-quality research findings. As microelectronics continues to play a pivotal role in shaping modern technology, MICROELECTRONICS INTERNATIONAL serves as an essential resource for advancing knowledge and inspiring future innovations.

Journal of Failure Analysis and Prevention

Advancing the Science of Safety and Reliability
Publisher: SPRINGERNATUREISSN: 1547-7029Frequency: 6 issues/year

Journal of Failure Analysis and Prevention, published by SpringerNature, stands as a vital resource in the fields of Materials Science, Mechanical Engineering, and Safety, Risk, Reliability and Quality. With an ISSN of 1547-7029 and an E-ISSN of 1864-1245, this journal has been dedicated to advancing the understanding of failure mechanisms and prevention strategies since its inception in 2001. Its convergence of rigorous research from various domains underscores its importance, achieving a Q3 classification across multiple engineering categories as of 2023. As of the latest rankings, it holds significant positions, including #114 in Safety, Risk, Reliability and Quality and #408 in Mechanical Engineering, illustrating its role in fostering scholarly dialogue and innovation. Although it does not currently offer open-access options, the journal endeavors to be accessible for researchers and professionals seeking impactful, high-quality analyses that inform both safety practices and engineering improvements. Whether you are a researcher pushing the boundaries of knowledge or a professional applying these principles, the Journal of Failure Analysis and Prevention is an indispensable part of your academic toolkit.

IEEE ELECTRON DEVICE LETTERS

Pioneering Research in Electrical Engineering
Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCISSN: 0741-3106Frequency: 12 issues/year

IEEE Electronics Device Letters, published by the esteemed IEEE-Institute of Electrical and Electronics Engineers Inc, stands at the forefront of innovation in the field of electrical and electronic engineering. With a rich history spanning from 1980 to 2024, this journal showcases groundbreaking research and letters that significantly contribute to the advancement of electronic, optical, and magnetic materials. Its impressive Q1 rankings in both Electrical and Electronic Engineering and Electronic, Optical, and Magnetic Materials underscore its pivotal role in shaping contemporary academic discourse. The journal maintains a strong position in Scopus rankings, positioned within the top 16% for Electrical and Electronic Engineering and the top 18% for Materials Science, making it a vital resource for researchers, professionals, and students alike. With the absence of open access, it maintains an exclusive repository of high-impact research that experts in the field turn to for the latest insights and developments. IEEE Electronics Device Letters is committed to providing a platform for the dissemination of transformative knowledge that fuels innovation and progress in the ever-evolving landscape of electronics.

Transactions on Electrical and Electronic Materials

Illuminating the Future of Electronic and Optical Materials
Publisher: SPRINGERISSN: 1229-7607Frequency: 6 issues/year

Transactions on Electrical and Electronic Materials, published by Springer, is a distinguished journal aimed at advancing the fields of electrical and electronic engineering, as well as electronic, optical, and magnetic materials. With an ISSN of 1229-7607 and an E-ISSN of 2092-7592, this journal is vital in disseminating impactful research and innovations, providing insights and significant findings that cater to both academia and industry. Holding a Q3 ranking in the categories of Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, it serves as a reputable platform for sharing research that influences ongoing developments in these critical areas. The journal's converged years from 2011 to 2024 signify its commitment to providing a comprehensive review of technological advancements. Located in New York City, it appeals to a global audience of researchers, professionals, and students, enhancing their understanding of current trends and practices within the domain.

ACS Applied Electronic Materials

Connecting Ideas in Electrochemistry and Beyond
Publisher: AMER CHEMICAL SOCISSN: Frequency: 12 issues/year

ACS Applied Electronic Materials, published by the American Chemical Society, is a prominent journal in the field of applied materials science, with a particular focus on electronic, optical, and magnetic materials. Established in 2019, this journal has quickly risen to prominence, achieving a 2023 ranking of Q1 in both Electronic, Optical and Magnetic Materials and Materials Chemistry, as well as Q2 in Electrochemistry, reflective of its high-quality contributions and significant impact within the scholarly community. With an impressive Scopus rank of #22 in Electrochemistry, #59 in Electronic, Optical and Magnetic Materials, and #75 in Materials Chemistry, ACS Applied Electronic Materials serves as an essential resource for researchers, professionals, and students seeking to explore innovative advancements in the field. While the journal is not open access, it offers robust subscription options and aims to foster the dissemination of cutting-edge research articles, reviews, and technical notes that contribute to the understanding and application of electronic materials in various technological contexts. As a platform for pioneering research and cross-disciplinary dialogue, this journal is indispensable for anyone invested in the future of materials science.

RELIABILITY ENGINEERING & SYSTEM SAFETY

Elevating Standards in Safety and Risk Management.
Publisher: ELSEVIER SCI LTDISSN: 0951-8320Frequency: 12 issues/year

RELIABILITY ENGINEERING & SYSTEM SAFETY is a leading interdisciplinary journal published by Elsevier Sci Ltd, dedicated to advancing knowledge in the fields of applied mathematics, industrial and manufacturing engineering, and safety, risk, reliability, and quality. With a significant presence since its inception in 1983, this esteemed journal, identifiable by ISSN 0951-8320 and E-ISSN 1879-0836, holds an impressive impact factor and ranks in the top quartile (Q1) of its categories according to the most recent metrics. Specifically, it has achieved remarkable standings in Scopus, ranking #3 out of 207 in Safety, Risk, Reliability and Quality, marking it in the 98th percentile, and #21 out of 384 in Industrial and Manufacturing Engineering, at the 94th percentile. This distinction underscores the journal's vital role in shaping research and innovation in its fields. While it does not operate under an open access model, RELIABILITY ENGINEERING & SYSTEM SAFETY remains an essential resource for researchers, professionals, and students, aiming to publish high-quality articles that facilitate the understanding and application of reliability engineering and systemic safety within various industrial contexts. Stay ahead in cutting-edge research by engaging with the latest articles and findings from this influential journal.

Journal of Semiconductor Technology and Science

Connecting Minds in Semiconductor Advancements
Publisher: IEEK PUBLICATION CENTERISSN: 1598-1657Frequency: 6 issues/year

The Journal of Semiconductor Technology and Science, published by the IEEK PUBLICATION CENTER, serves as a vital platform for advancing the field of semiconductor technology and materials science. With its ISSN 1598-1657 and E-ISSN 2233-4866, this journal has been pivotal since its inception in 2005, continuing to shed light on innovative research until 2024. Although currently classified in the Q4 category for both Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, it remains a crucial resource for those in industry and academia alike, providing in-depth analyses and findings that explore the complexities of semiconductor applications. Researchers and professionals will find value in its comprehensive articles that address current trends and future directions in semiconductor technologies. This open-access journal, published in South Korea, is positioned to foster collaboration among students, professionals, and leading researchers in the ever-evolving technology landscape.