Engineering Failure Analysis is a prestigious peer-reviewed journal published by PERGAMON-ELSEVIER SCIENCE LTD, dedicated to advancing the field of engineering through comprehensive investigations into the causes and consequences of failures in various engineering domains. Established in 1994, the journal has become a cornerstone of knowledge in sectors such as Aerospace, Automotive, and Materials Science, earning its place within the Q1 quartile across multiple relevant categories in 2023. With a broad scope that encompasses topics related to safety, risk, reliability, and quality, it serves as a vital resource for researchers, professionals, and students keen on understanding how to mitigate failures and improve engineering practices. Although this journal does not currently offer Open Access, its impact is underscored by its high Scopus ranking, where it sits comfortably in the 36th position out of 307 in General Engineering. By bridging theoretical insights and practical applications, Engineering Failure Analysis plays a pivotal role in shaping the future of engineering standards and safety practices.

Bridge Structures is an esteemed academic journal dedicated to the field of structural engineering, particularly focusing on the design, analysis, and maintenance of bridge systems. Published by IOS PRESS, a reputable publisher known for its contributions to various scientific fields, the journal serves as an integral platform for disseminating innovative research and advancements within the domain. With an ISSN of 1573-2487 and an E-ISSN of 1744-8999, Bridge Structures has established itself over the years—covering contributions from 2005 to 2024. The journal has attained a commendable ranking within the Q3 category in Building and Construction and holds a position within the 28th percentile among its peers according to the Scopus rankings. Though the journal operates on a subscription basis, its commitment to advancing engineering knowledge is paramount, making it essential reading for researchers, practitioners, and students eager to deepen their understanding of bridge engineering. The journal not only explores theoretical advancements but also emphasizes practical applications, providing a well-rounded perspective on current challenges and solutions in the field of bridge structures.

SOLID-STATE ELECTRONICS, published by Pergamon-Elsevier Science Ltd, is a highly regarded journal committed to advancing the field of solid-state physics and its applications. With an ISSN of 0038-1101 and an E-ISSN of 1879-2405, this journal has been a cornerstone of scholarly communication since its inception in 1960. Covering a rich spectrum of topics, it features in the Q3 category for Condensed Matter Physics, Electrical and Electronic Engineering, and Materials Science, reflecting its robust engagement in these critical fields. Despite not being an open-access journal, it provides valuable insights and research findings accessible to both academia and industry professionals, ensuring the dissemination of cutting-edge knowledge. With a strong focus on empirical research and theoretical developments, SOLID-STATE ELECTRONICS aims to bridge the gap between fundamental science and practical application, making it an essential resource for researchers, professionals, and students alike in the United Kingdom and beyond.

MICROELECTRONICS RELIABILITY, published by PERGAMON-ELSEVIER SCIENCE LTD, is a pivotal journal that serves the advancing field of microelectronics and materials reliability. With its ISSN 0026-2714 and E-ISSN 1872-941X, this journal has been at the forefront of disseminating research since its inception in 1962 and is set to continue exploring cutting-edge topics through 2024. The journal holds a respectable presence across several categories, achieving a Q3 ranking in areas such as Atomic and Molecular Physics and Electrical and Electronic Engineering, highlighting its broad interdisciplinary appeal, while also ranking in the Q2 category for Safety, Risk, Reliability, and Quality, which speaks to its commitment to ensuring standards in technological advancements. Access to this journal is subscription-based, making it an essential resource for researchers, professionals, and students seeking reliable information and data regarding electronic material performance and reliability assessment. Located in Kidlington, Oxford, UK, MICROELECTRONICS RELIABILITY is dedicated to advancing the field and addressing the critical issues associated with the reliability of microelectronic devices, thereby supporting innovations that shape our technological future.

JOURNAL OF ELECTRONIC PACKAGING, published by the esteemed American Society of Mechanical Engineers (ASME), is a pivotal platform for research in the fields of Computer Science Applications, Electrical and Electronic Engineering, and Materials Science, particularly focusing on electronic packaging technologies. With an ISSN of 1043-7398 and an E-ISSN of 1528-9044, this journal has consistently showcased groundbreaking studies since its inception in 1989, projected to continue until 2025. Recognized within the Q2 quartile rankings across multiple categories in the 2023 Scopus rankings, it maintains a strong presence in the academic community with notable rankings in various engineering and materials science domains. This journal serves as a critical resource for researchers, professionals, and students who seek to advance their understanding and application of innovative electronic packaging solutions. Though it does not offer open access, it encompasses a robust array of high-quality articles that foster knowledge advancement and interdisciplinary collaboration in a rapidly evolving technological landscape, ultimately contributing to the growth and sophistication of the electronic packaging field.

MICROELECTRONICS INTERNATIONAL is a distinguished peer-reviewed journal published by Emerald Group Publishing Ltd, focusing on the expansive domains of microelectronics, materials science, and physics. With its ISSN 1356-5362 and E-ISSN 1758-812X, the journal has been a critical platform for researchers since its inception in 1982. Although it currently holds a Q4 category ranking across multiple disciplines such as Atomic and Molecular Physics, Electronic Engineering, and Surfaces, Coatings and Films, it remains committed to advancing scholarship and fostering dialogue within these fields. The journal's scope encompasses innovative research and developments that contribute to the understanding and technological evolution of microelectronic materials and systems. While it doesn't offer open access, its content is accessible through various academic databases, enabling a broad audience of professionals and enthusiasts to engage with high-quality research findings. As microelectronics continues to play a pivotal role in shaping modern technology, MICROELECTRONICS INTERNATIONAL serves as an essential resource for advancing knowledge and inspiring future innovations.

ACS Applied Electronic Materials, published by the American Chemical Society, is a prominent journal in the field of applied materials science, with a particular focus on electronic, optical, and magnetic materials. Established in 2019, this journal has quickly risen to prominence, achieving a 2023 ranking of Q1 in both Electronic, Optical and Magnetic Materials and Materials Chemistry, as well as Q2 in Electrochemistry, reflective of its high-quality contributions and significant impact within the scholarly community. With an impressive Scopus rank of #22 in Electrochemistry, #59 in Electronic, Optical and Magnetic Materials, and #75 in Materials Chemistry, ACS Applied Electronic Materials serves as an essential resource for researchers, professionals, and students seeking to explore innovative advancements in the field. While the journal is not open access, it offers robust subscription options and aims to foster the dissemination of cutting-edge research articles, reviews, and technical notes that contribute to the understanding and application of electronic materials in various technological contexts. As a platform for pioneering research and cross-disciplinary dialogue, this journal is indispensable for anyone invested in the future of materials science.

Integration - The VLSI Journal, published by Elsevier, stands as a significant contributor to the fields of Electrical and Electronic Engineering, Hardware and Architecture, and Software. With its ISSN 0167-9260 and E-ISSN 1872-7522, this journal caters to a global audience interested in cutting-edge research and advancements in Very Large Scale Integration (VLSI) technologies and methodologies. As of 2023, the journal is classified in the Q3 category in its respective fields, demonstrating its commitment to quality and relevance in engineering. Researchers, practitioners, and students can benefit from its rigorous peer-review process, which ensures the publication of high-impact studies and innovative findings within the engineering landscape. Boasting a converged history from 1983 to 2025, Integration - The VLSI Journal continues to foster scholarly exchange and collaboration, making it an essential resource for anyone aiming to stay at the forefront of VLSI research.

IEEE Electronics Device Letters, published by the esteemed IEEE-Institute of Electrical and Electronics Engineers Inc, stands at the forefront of innovation in the field of electrical and electronic engineering. With a rich history spanning from 1980 to 2024, this journal showcases groundbreaking research and letters that significantly contribute to the advancement of electronic, optical, and magnetic materials. Its impressive Q1 rankings in both Electrical and Electronic Engineering and Electronic, Optical, and Magnetic Materials underscore its pivotal role in shaping contemporary academic discourse. The journal maintains a strong position in Scopus rankings, positioned within the top 16% for Electrical and Electronic Engineering and the top 18% for Materials Science, making it a vital resource for researchers, professionals, and students alike. With the absence of open access, it maintains an exclusive repository of high-impact research that experts in the field turn to for the latest insights and developments. IEEE Electronics Device Letters is committed to providing a platform for the dissemination of transformative knowledge that fuels innovation and progress in the ever-evolving landscape of electronics.

Journal of Failure Analysis and Prevention, published by SpringerNature, stands as a vital resource in the fields of Materials Science, Mechanical Engineering, and Safety, Risk, Reliability and Quality. With an ISSN of 1547-7029 and an E-ISSN of 1864-1245, this journal has been dedicated to advancing the understanding of failure mechanisms and prevention strategies since its inception in 2001. Its convergence of rigorous research from various domains underscores its importance, achieving a Q3 classification across multiple engineering categories as of 2023. As of the latest rankings, it holds significant positions, including #114 in Safety, Risk, Reliability and Quality and #408 in Mechanical Engineering, illustrating its role in fostering scholarly dialogue and innovation. Although it does not currently offer open-access options, the journal endeavors to be accessible for researchers and professionals seeking impactful, high-quality analyses that inform both safety practices and engineering improvements. Whether you are a researcher pushing the boundaries of knowledge or a professional applying these principles, the Journal of Failure Analysis and Prevention is an indispensable part of your academic toolkit.