Journal of Micro-Nanopatterning Materials and Metrology-JM3
Scope & Guideline
Bridging Disciplines for a New Era in Micro-Nanopatterning
Introduction
Aims and Scopes
- Lithography Techniques:
The journal emphasizes various lithography methods including photolithography, electron beam lithography, and nanoimprint lithography. Research in this area focuses on improving resolution, throughput, and defect reduction. - Metrology Innovations:
A core focus is on developing and refining metrology techniques for measuring critical dimensions, overlay accuracy, and defect detection in semiconductor manufacturing. This includes advanced imaging and measurement techniques. - Material Development:
The journal covers studies on new materials for lithography, including photoresists and mask materials, with an emphasis on chemical formulations and their performance in extreme ultraviolet (EUV) lithography. - Computational Approaches and Machine Learning:
There is a growing body of work on computational modeling and machine learning applications aimed at optimizing lithographic processes and improving defect detection and characterization. - Advanced Packaging Technologies:
Research related to advanced packaging solutions, such as panel-level packaging and integration of micro and nano devices, is increasingly featured, reflecting industry trends towards miniaturization and enhanced performance.
Trending and Emerging
- Curvilinear Mask Technologies:
Research into curvilinear mask design and metrology is on the rise, addressing the challenges posed by complex geometries in modern semiconductor devices and enhancing performance in advanced lithography. - Machine Learning Applications:
There is a notable increase in the application of machine learning techniques for optimizing lithography processes, defect detection, and metrology, demonstrating the potential of AI in semiconductor manufacturing. - EUV Lithography Advances:
With the ongoing deployment of EUV lithography in production, research focused on improving EUV materials, processes, and metrology techniques is trending, highlighting its critical role in future semiconductor manufacturing. - Panel-Level Packaging Innovations:
As the demand for advanced packaging solutions increases, research on panel-level packaging and integration technologies is emerging, reflecting industry trends towards miniaturization and performance enhancement. - 3D and Multi-dimensional Metrology:
Emerging themes in three-dimensional metrology techniques are gaining attention, with a focus on improving accuracy and precision in measuring complex structures in semiconductor devices.
Declining or Waning
- Traditional Optical Lithography:
As the industry moves towards extreme ultraviolet (EUV) and other advanced lithography techniques, traditional optical lithography methods appear less frequently in newer publications. - Single Patterning Techniques:
Research on single patterning techniques is becoming less common, as the industry increasingly adopts multi-patterning approaches to meet the demands of smaller feature sizes. - Basic Resist Chemistry:
While foundational studies in resist chemistry were prominent in earlier years, recent publications suggest a shift towards more application-focused research, potentially reducing the emphasis on fundamental resist chemistry. - General Reviews on Historical Techniques:
There seems to be a waning interest in broad reviews of older lithographic techniques, as the focus shifts to novel and emerging technologies that are more relevant to current industry challenges.
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