Journal of Micro-Nanopatterning Materials and Metrology-JM3

Scope & Guideline

Exploring the Intersection of Theory and Practice in Nanotechnology

Introduction

Immerse yourself in the scholarly insights of Journal of Micro-Nanopatterning Materials and Metrology-JM3 with our comprehensive guidelines detailing its aims and scope. This page is your resource for understanding the journal's thematic priorities. Stay abreast of trending topics currently drawing significant attention and explore declining topics for a full picture of evolving interests. Our selection of highly cited topics and recent high-impact papers is curated within these guidelines to enhance your research impact.
LanguageEnglish
ISSN1932-5150
PublisherSPIE-SOC PHOTO-OPTICAL INSTRUMENTATION ENGINEERS
Support Open AccessNo
CountryUnited States
TypeJournal
Convergefrom 2007 to 2024
AbbreviationJ MICRO-NANOPATTERN / J. Micro-Nanopatterning Mater. Metrol.-JM3
Frequency4 issues/year
Time To First Decision-
Time To Acceptance-
Acceptance Rate-
Home Page-
Address1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98225

Aims and Scopes

The Journal of Micro-Nanopatterning Materials and Metrology (JM3) is dedicated to advancing the field of micro and nano fabrication technologies, focusing on metrology, materials, and lithographic techniques. The journal covers a wide spectrum of topics critical to the semiconductor industry and related fields, aiming to provide a platform for innovative research and development in lithography and measurement techniques.
  1. Lithography Techniques:
    The journal emphasizes various lithography methods including photolithography, electron beam lithography, and nanoimprint lithography. Research in this area focuses on improving resolution, throughput, and defect reduction.
  2. Metrology Innovations:
    A core focus is on developing and refining metrology techniques for measuring critical dimensions, overlay accuracy, and defect detection in semiconductor manufacturing. This includes advanced imaging and measurement techniques.
  3. Material Development:
    The journal covers studies on new materials for lithography, including photoresists and mask materials, with an emphasis on chemical formulations and their performance in extreme ultraviolet (EUV) lithography.
  4. Computational Approaches and Machine Learning:
    There is a growing body of work on computational modeling and machine learning applications aimed at optimizing lithographic processes and improving defect detection and characterization.
  5. Advanced Packaging Technologies:
    Research related to advanced packaging solutions, such as panel-level packaging and integration of micro and nano devices, is increasingly featured, reflecting industry trends towards miniaturization and enhanced performance.
The journal has identified several emerging themes and trends that are gaining traction, reflecting advancements in technology and the evolving needs of the semiconductor industry. These trends indicate a shift towards more integrated, efficient, and advanced methodologies.
  1. Curvilinear Mask Technologies:
    Research into curvilinear mask design and metrology is on the rise, addressing the challenges posed by complex geometries in modern semiconductor devices and enhancing performance in advanced lithography.
  2. Machine Learning Applications:
    There is a notable increase in the application of machine learning techniques for optimizing lithography processes, defect detection, and metrology, demonstrating the potential of AI in semiconductor manufacturing.
  3. EUV Lithography Advances:
    With the ongoing deployment of EUV lithography in production, research focused on improving EUV materials, processes, and metrology techniques is trending, highlighting its critical role in future semiconductor manufacturing.
  4. Panel-Level Packaging Innovations:
    As the demand for advanced packaging solutions increases, research on panel-level packaging and integration technologies is emerging, reflecting industry trends towards miniaturization and performance enhancement.
  5. 3D and Multi-dimensional Metrology:
    Emerging themes in three-dimensional metrology techniques are gaining attention, with a focus on improving accuracy and precision in measuring complex structures in semiconductor devices.

Declining or Waning

While the journal continues to cover a broad range of topics, certain themes appear to be declining in prominence based on recent publications. This may reflect shifts in industry focus or advancements in technology rendering some approaches less relevant.
  1. Traditional Optical Lithography:
    As the industry moves towards extreme ultraviolet (EUV) and other advanced lithography techniques, traditional optical lithography methods appear less frequently in newer publications.
  2. Single Patterning Techniques:
    Research on single patterning techniques is becoming less common, as the industry increasingly adopts multi-patterning approaches to meet the demands of smaller feature sizes.
  3. Basic Resist Chemistry:
    While foundational studies in resist chemistry were prominent in earlier years, recent publications suggest a shift towards more application-focused research, potentially reducing the emphasis on fundamental resist chemistry.
  4. General Reviews on Historical Techniques:
    There seems to be a waning interest in broad reviews of older lithographic techniques, as the focus shifts to novel and emerging technologies that are more relevant to current industry challenges.

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