JOURNAL OF ELECTRONIC PACKAGING
Scope & Guideline
Unveiling Breakthroughs in Electronic Packaging
Introduction
Aims and Scopes
- Thermal Management Solutions:
The journal emphasizes research related to innovative thermal management strategies, including liquid cooling, heat sink design, and thermal interface materials, aimed at enhancing the performance and reliability of electronic systems. - Reliability and Failure Analysis:
A core area of focus is the reliability of electronic components and systems. This encompasses studies on solder joint reliability, electromigration, and fatigue life under various operating conditions. - Advanced Materials and Manufacturing Techniques:
The exploration of new materials for electronic packaging, such as lead-free solders and nanocomposites, as well as advanced manufacturing techniques like additive manufacturing and aerosol jet printing, is a significant aspect of the journal. - Modeling and Simulation:
The journal publishes research that employs modeling and simulation techniques, including finite element analysis and machine learning, to predict thermal, mechanical, and electrical behaviors in electronic packaging. - Heterogeneous Integration and Miniaturization:
Research on heterogeneous integration methods and miniaturization techniques for electronic components, such as chiplets and 3D packaging, is highlighted to address the demand for smaller and more efficient electronic devices.
Trending and Emerging
- Machine Learning and Artificial Intelligence Applications:
There is a growing trend in the application of machine learning and AI for predictive modeling and optimization in electronic packaging. This includes fatigue life prediction and reliability assessments, indicating a merging of traditional engineering with data-driven approaches. - Sustainability and Eco-Friendly Materials:
Research focusing on sustainable materials and processes, such as lead-free solders and eco-friendly manufacturing methods, is gaining traction as the electronics industry moves towards greener practices. - Advanced Cooling Technologies:
Emerging cooling technologies, such as two-phase cooling and thermosyphon systems, are increasingly popular, reflecting the need for efficient thermal management solutions in high-density electronic applications. - Integration of IoT and Smart Electronics:
The integration of electronic packaging with IoT devices and smart technologies is on the rise, focusing on reliability and performance in connected systems, which is crucial for future advancements in consumer electronics. - 3D Packaging and Chiplet Design:
The trend towards 3D packaging and chiplet architectures is becoming more pronounced, driven by the demand for compact and high-performance electronic systems that support heterogeneous integration.
Declining or Waning
- Traditional Soldering Techniques:
Research focusing on conventional soldering methods has decreased, likely due to the industry’s shift towards lead-free and advanced soldering techniques that enhance reliability and performance. - Low-Temperature Applications:
There appears to be a waning interest in studies specifically targeting low-temperature applications, as more research is directed towards high-temperature stability and performance in electronics. - Basic Thermal Analysis Methods:
Fundamental thermal analysis methods are becoming less prominent, giving way to more sophisticated approaches that incorporate multi-physics modeling and advanced computational techniques. - Electromechanical Systems:
The focus on electromechanical systems within packaging has diminished, possibly due to a broader emphasis on integrated circuits and semiconductor devices that dominate the current landscape.
Similar Journals
World Journal of Engineering
Pioneering Insights Across Diverse Engineering DisciplinesWorld Journal of Engineering, published by EMERALD GROUP PUBLISHING LTD, stands as a premier platform for disseminating high-quality research across various engineering disciplines. Since its inception in 2014, the journal has built a reputation for its rigorous peer-review process and commitment to advancing knowledge in the fields of Civil and Structural Engineering, Electrical and Electronic Engineering, Geotechnical Engineering, Mechanical Engineering, and Mechanics of Materials. With its categorization in the Q3 quartile across multiple engineering domains and notable Scopus rankings, the journal positions itself as a valuable resource for researchers, professionals, and students seeking to stay abreast of innovations and critical developments in engineering. While the journal currently operates under a subscription model, its comprehensive scope ensures that it remains a vital reference point for contemporary engineering challenges and solutions throughout the United Kingdom and beyond.
Batteries-Basel
Empowering Research in Energy SolutionsBatteries-Basel, published by MDPI, is a premier open-access journal since 2015 that aims to serve the growing community focused on the technological advancements and innovations in battery science and related fields. Operating from its base in Switzerland, this journal publishes high-quality research covering the fields of Electrical and Electronic Engineering, Electrochemistry, and Energy Engineering and Power Technology. With a commendable Q2 ranking in multiple categories for 2023, it consistently strives to present cutting-edge studies, reviews, and practical applications that drive progress in energy storage technologies. Researchers and professionals will find invaluable insights within its pages, contributing to both theoretical understanding and practical deployment of battery technologies. Open access provides broad dissemination of knowledge, ensuring that discoveries reach a global audience, and fostering collaborative efforts to address the challenges posed by modern energy demands.
MACROMOLECULAR RESEARCH
Exploring Innovations in Macromolecular EngineeringMACROMOLECULAR RESEARCH, published by the POLYMER SOC KOREA, is a premier journal dedicated to advancing the field of macromolecular science and polymer engineering. With its ISSN 1598-5032 and E-ISSN 2092-7673, this journal has emerged as a vital platform for researchers and professionals interested in the application and development of polymers across various domains. Based in South Korea and operating as an open-access resource since its inception in 2002, MACROMOLECULAR RESEARCH consistently ranks in the Q2 category across diverse fields such as Chemical Engineering, Materials Chemistry, and Organic Chemistry as per the latest 2023 metrics. Notably, it is recognized for its substantial contributions to polymery science, increasing its visibility and impact in global research. By providing a forum for original research articles, reviews, and innovative methodologies, this journal aims to foster collaboration and knowledge sharing among scientists, engineers, and students alike. Join a community that is at the forefront of polymer research by exploring the wealth of resources and cutting-edge studies featured in MACROMOLECULAR RESEARCH.
STROJNISKI VESTNIK-JOURNAL OF MECHANICAL ENGINEERING
Advancing Mechanical Engineering Knowledge Since 1974STROJNISKI VESTNIK-JOURNAL OF MECHANICAL ENGINEERING is a prestigious publication that has been disseminating cutting-edge research in the field of mechanical engineering since 1974. Published by the Association of Mechanical Engineers Technicians Slovenia, this journal serves as a critical platform for professionals, researchers, and students aiming to explore advancements in mechanical engineering and mechanics of materials. With a category ranking in the Q3 quartile for both Mechanical Engineering and Mechanics of Materials, the journal reflects a robust engagement with contemporary research and practices, contributing to the ongoing discourse within these vital disciplines. Although currently not open access, the journal is committed to providing high-quality, peer-reviewed articles that facilitate knowledge sharing and innovation. It is indexed in Scopus, maintaining respectable standings within its categories, thereby underlining its importance and impact in the global academic community.
SOLDERING & SURFACE MOUNT TECHNOLOGY
Elevating Standards in Soldering Techniques and ApplicationsSOLDERING & SURFACE MOUNT TECHNOLOGY is a prominent peer-reviewed journal published by Emerald Group Publishing Ltd in the United Kingdom, showcasing its commitment to advancing the fields of Electrical and Electronic Engineering, Condensed Matter Physics, and Materials Science. With a strong publication history dating back to 1989 and continuing through 2024, this journal provides a vital platform for disseminating innovative research and technological developments in soldering and surface mount technology. It holds a respectable ranking within its categories, including a Q3 classification in multiple fields according to the 2023 category quartiles, with Scopus rankings reflecting its growing influence in the academic community (e.g., #316/797 in Electrical and Electronic Engineering). While this journal does not offer open access, it remains an essential resource for researchers, practitioners, and students who aim to stay informed about cutting-edge advancements and trends in this dynamic area of study. By focusing on high-quality research contributions, SOLDERING & SURFACE MOUNT TECHNOLOGY continues to play a crucial role in fostering innovation and knowledge exchange within its scope.
Functional Composites and Structures
Connecting Researchers with Cutting-Edge Discoveries.Functional Composites and Structures is a prestigious academic journal published by IOP Publishing Ltd, dedicated to advancing the field of materials science with a focus on innovative composite materials and their structural applications. Established in 2019 and running through 2024, this journal uniquely bridges several disciplines, consistently ranking in the Q2 quartile across key categories including Ceramics and Composites, Electronic, Optical and Magnetic Materials, and Mechanics of Materials. With a commendable Scopus rank that places it within the top tiers of its field, the journal is instrumental for researchers, engineers, and scholars seeking to explore the latest developments in material properties, functionality, and applications. Although access options are not specified, the open-access nature of the journal promotes wider dissemination and engagement with cutting-edge research. As the demand for smarter, more efficient materials continues to grow, Functional Composites and Structures serves as a vital resource for fostering collaboration and driving innovation in material sciences.
RARE METAL MATERIALS AND ENGINEERING
Connecting Knowledge in Materials Chemistry and EngineeringRARE METAL MATERIALS AND ENGINEERING is a vital academic journal dedicated to advancing the fields of materials science, engineering, and metallurgy. Published by the NORTHWEST INST NONFERROUS METAL RESEARCH in China, this journal has been an essential resource for researchers and professionals since its inception in 1993. With a focus on rare metals and their engineering applications, the journal addresses contemporary issues and innovations in materials chemistry and electronic engineering, providing insights into the properties and uses of advanced materials. Although it currently falls within the Q4 category for several categories, including Electrical and Electronic Engineering and Materials Chemistry, its commitment to quality and relevance in the field is evident. The journal offers a platform for researchers to share their findings with the scientific community, fostering collaboration and knowledge exchange in an important area of study. Researchers and students interested in exploring the latest in rare metal technologies and engineering methodologies will find this journal a valuable addition to their academic library.
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Exploring Innovations in Device and Material Reliability for a Sustainable Future.IEEE Transactions on Device and Materials Reliability stands as a leading journal in the field of reliability engineering, specializing in the intricate connections between device performance and materials efficacy. Published by the renowned IEEE-Institute of Electrical and Electronics Engineers Inc., this journal boasts a commendable impact factor and exhibits robust Scopus rankings across various categories, including electrical and electronic engineering and safety, risk, reliability, and quality. With a publication timeline from 2001 to 2024, it serves as an essential resource for researchers and professionals alike, providing comprehensive insights into current advancements and challenges in device reliability and materials science. Although it operates under a subscription model, the journal's extensive contributions are crucial for fostering significant innovations that ensure the integrity and longevity of electronic devices in a rapidly evolving technological landscape. Researchers, professionals, and students delving into this vital domain will find IEEE Transactions on Device and Materials Reliability a valuable platform to disseminate their findings and explore the latest trends.
JOURNAL OF ELECTRONIC MATERIALS
Exploring Innovations in Materials Science Since 1972Welcome to the Journal of Electronic Materials, a premier publication in the field of materials science. Published by Springer, this esteemed journal has been a beacon for groundbreaking research in electronic, optical, and magnetic materials since its inception in 1972. As an established resource, it boasts a commendable impact factor and categorically ranks in the second quartile (Q2) in key areas such as Condensed Matter Physics and Electrical and Electronic Engineering, as well as holding a respectable third quartile ranking in fields related to Electronic, Optical, and Magnetic Materials and Materials Chemistry. Researchers, professionals, and students can access a wealth of knowledge as we publish original articles, reviews, and cutting-edge research that push the boundaries of science and technology in these critical fields. Stay informed and engaged as we explore advancements that shape the future of electronic materials.
Korean Journal of Metals and Materials
Elevating Knowledge in Metals and Materials ScienceWelcome to the Korean Journal of Metals and Materials, a premier publication dedicated to advancing research in the interdisciplinary fields of metals and materials science. Published by the Korean Institute of Metals and Materials, this journal aims to foster the dissemination of innovative findings and significant developments across various domains, including electronic, optical, and magnetic materials, metals and alloys, as well as modeling, simulation, and surface coatings. With a commendable Q3 quartile ranking in several relevant categories as of 2023, it serves as a vital resource for researchers, professionals, and students interested in the latest scientific trends and technological applications. The journal has successfully converged from 2007 to 2024, showcasing a rich archive of knowledge. Engaging with this publication gives readers the opportunity to stay updated with critical advancements and enhances collaboration within the vibrant materials science community. Access is available through various platforms, ensuring that our content is widely accessible to all those striving for excellence in the field.