JOURNAL OF ELECTRONIC PACKAGING

Scope & Guideline

Advancing the Future of Electronic Packaging

Introduction

Welcome to your portal for understanding JOURNAL OF ELECTRONIC PACKAGING, featuring guidelines for its aims and scope. Our guidelines cover trending and emerging topics, identifying the forefront of research. Additionally, we track declining topics, offering insights into areas experiencing reduced scholarly attention. Key highlights include highly cited topics and recently published papers, curated within these guidelines to assist you in navigating influential academic dialogues.
LanguageEnglish
ISSN1043-7398
PublisherASME
Support Open AccessNo
CountryUnited States
TypeJournal
Convergefrom 1989 to 2025
AbbreviationJ ELECTRON PACKAGING / J. Electron. Packag.
Frequency4 issues/year
Time To First Decision-
Time To Acceptance-
Acceptance Rate-
Home Page-
AddressTWO PARK AVE, NEW YORK, NY 10016-5990

Aims and Scopes

The JOURNAL OF ELECTRONIC PACKAGING focuses on the interdisciplinary field of electronic packaging, combining aspects of materials science, mechanical engineering, thermal management, and electrical engineering. The journal aims to publish cutting-edge research that contributes to the advancement of electronic packaging technologies, ensuring reliability and performance in electronic systems.
  1. Thermal Management Solutions:
    The journal emphasizes research related to innovative thermal management strategies, including liquid cooling, heat sink design, and thermal interface materials, aimed at enhancing the performance and reliability of electronic systems.
  2. Reliability and Failure Analysis:
    A core area of focus is the reliability of electronic components and systems. This encompasses studies on solder joint reliability, electromigration, and fatigue life under various operating conditions.
  3. Advanced Materials and Manufacturing Techniques:
    The exploration of new materials for electronic packaging, such as lead-free solders and nanocomposites, as well as advanced manufacturing techniques like additive manufacturing and aerosol jet printing, is a significant aspect of the journal.
  4. Modeling and Simulation:
    The journal publishes research that employs modeling and simulation techniques, including finite element analysis and machine learning, to predict thermal, mechanical, and electrical behaviors in electronic packaging.
  5. Heterogeneous Integration and Miniaturization:
    Research on heterogeneous integration methods and miniaturization techniques for electronic components, such as chiplets and 3D packaging, is highlighted to address the demand for smaller and more efficient electronic devices.
The JOURNAL OF ELECTRONIC PACKAGING has seen an increase in publications addressing several emerging themes that reflect contemporary challenges and advancements in the field. These trends indicate a shift towards more innovative and complex solutions in electronic packaging.
  1. Machine Learning and Artificial Intelligence Applications:
    There is a growing trend in the application of machine learning and AI for predictive modeling and optimization in electronic packaging. This includes fatigue life prediction and reliability assessments, indicating a merging of traditional engineering with data-driven approaches.
  2. Sustainability and Eco-Friendly Materials:
    Research focusing on sustainable materials and processes, such as lead-free solders and eco-friendly manufacturing methods, is gaining traction as the electronics industry moves towards greener practices.
  3. Advanced Cooling Technologies:
    Emerging cooling technologies, such as two-phase cooling and thermosyphon systems, are increasingly popular, reflecting the need for efficient thermal management solutions in high-density electronic applications.
  4. Integration of IoT and Smart Electronics:
    The integration of electronic packaging with IoT devices and smart technologies is on the rise, focusing on reliability and performance in connected systems, which is crucial for future advancements in consumer electronics.
  5. 3D Packaging and Chiplet Design:
    The trend towards 3D packaging and chiplet architectures is becoming more pronounced, driven by the demand for compact and high-performance electronic systems that support heterogeneous integration.

Declining or Waning

As the field of electronic packaging evolves, certain themes have experienced a decline in publication frequency. This section identifies these waning scopes, reflecting shifts in research interests and technological advancements.
  1. Traditional Soldering Techniques:
    Research focusing on conventional soldering methods has decreased, likely due to the industry’s shift towards lead-free and advanced soldering techniques that enhance reliability and performance.
  2. Low-Temperature Applications:
    There appears to be a waning interest in studies specifically targeting low-temperature applications, as more research is directed towards high-temperature stability and performance in electronics.
  3. Basic Thermal Analysis Methods:
    Fundamental thermal analysis methods are becoming less prominent, giving way to more sophisticated approaches that incorporate multi-physics modeling and advanced computational techniques.
  4. Electromechanical Systems:
    The focus on electromechanical systems within packaging has diminished, possibly due to a broader emphasis on integrated circuits and semiconductor devices that dominate the current landscape.

Similar Journals

Frontiers in Mechanical Engineering-Switzerland

Pioneering Research for a Sustainable Future
Publisher: FRONTIERS MEDIA SAISSN: Frequency: 1 issue/year

Frontiers in Mechanical Engineering-Switzerland, published by FRONTIERS MEDIA SA, is a pioneering open-access journal that has been fostering innovations in the field of mechanical engineering since its inception in 2015. Based in Switzerland, this journal provides a robust platform for disseminating cutting-edge research across multiple disciplines within mechanical engineering, including materials science, industrial and manufacturing engineering, and computer science applications. With impressive Scopus rankings, including Q2 statuses in key categories such as Industrial and Manufacturing Engineering and Mechanical Engineering, it stands out as a valuable resource for researchers and practitioners aiming to stay abreast of trends and breakthroughs in these fields. By embracing open-access principles, the journal ensures that high-quality research is readily available to a global audience, thereby promoting collaboration and knowledge sharing. As it continues to grow, Frontiers in Mechanical Engineering is poised to make significant contributions to both academic and professional communities, enhancing understanding and advancing practices in engineering disciplines.

SOLDERING & SURFACE MOUNT TECHNOLOGY

Transforming Research into Real-World Solutions
Publisher: EMERALD GROUP PUBLISHING LTDISSN: 0954-0911Frequency: 4 issues/year

SOLDERING & SURFACE MOUNT TECHNOLOGY is a prominent peer-reviewed journal published by Emerald Group Publishing Ltd in the United Kingdom, showcasing its commitment to advancing the fields of Electrical and Electronic Engineering, Condensed Matter Physics, and Materials Science. With a strong publication history dating back to 1989 and continuing through 2024, this journal provides a vital platform for disseminating innovative research and technological developments in soldering and surface mount technology. It holds a respectable ranking within its categories, including a Q3 classification in multiple fields according to the 2023 category quartiles, with Scopus rankings reflecting its growing influence in the academic community (e.g., #316/797 in Electrical and Electronic Engineering). While this journal does not offer open access, it remains an essential resource for researchers, practitioners, and students who aim to stay informed about cutting-edge advancements and trends in this dynamic area of study. By focusing on high-quality research contributions, SOLDERING & SURFACE MOUNT TECHNOLOGY continues to play a crucial role in fostering innovation and knowledge exchange within its scope.

STROJNISKI VESTNIK-JOURNAL OF MECHANICAL ENGINEERING

Cultivating a Community of Mechanical Engineering Experts
Publisher: ASSOC MECHANICAL ENGINEERS TECHNICIANS SLOVENIAISSN: 0039-2480Frequency: 12 issues/year

STROJNISKI VESTNIK-JOURNAL OF MECHANICAL ENGINEERING is a prestigious publication that has been disseminating cutting-edge research in the field of mechanical engineering since 1974. Published by the Association of Mechanical Engineers Technicians Slovenia, this journal serves as a critical platform for professionals, researchers, and students aiming to explore advancements in mechanical engineering and mechanics of materials. With a category ranking in the Q3 quartile for both Mechanical Engineering and Mechanics of Materials, the journal reflects a robust engagement with contemporary research and practices, contributing to the ongoing discourse within these vital disciplines. Although currently not open access, the journal is committed to providing high-quality, peer-reviewed articles that facilitate knowledge sharing and innovation. It is indexed in Scopus, maintaining respectable standings within its categories, thereby underlining its importance and impact in the global academic community.

Korean Journal of Metals and Materials

Connecting Researchers in the World of Metals and Materials
Publisher: KOREAN INST METALS MATERIALSISSN: 1738-8228Frequency: 10 issues/year

Welcome to the Korean Journal of Metals and Materials, a premier publication dedicated to advancing research in the interdisciplinary fields of metals and materials science. Published by the Korean Institute of Metals and Materials, this journal aims to foster the dissemination of innovative findings and significant developments across various domains, including electronic, optical, and magnetic materials, metals and alloys, as well as modeling, simulation, and surface coatings. With a commendable Q3 quartile ranking in several relevant categories as of 2023, it serves as a vital resource for researchers, professionals, and students interested in the latest scientific trends and technological applications. The journal has successfully converged from 2007 to 2024, showcasing a rich archive of knowledge. Engaging with this publication gives readers the opportunity to stay updated with critical advancements and enhances collaboration within the vibrant materials science community. Access is available through various platforms, ensuring that our content is widely accessible to all those striving for excellence in the field.

Batteries-Basel

Innovating Battery Science for a Sustainable Tomorrow
Publisher: MDPIISSN: Frequency: 12 issues/year

Batteries-Basel, published by MDPI, is a premier open-access journal since 2015 that aims to serve the growing community focused on the technological advancements and innovations in battery science and related fields. Operating from its base in Switzerland, this journal publishes high-quality research covering the fields of Electrical and Electronic Engineering, Electrochemistry, and Energy Engineering and Power Technology. With a commendable Q2 ranking in multiple categories for 2023, it consistently strives to present cutting-edge studies, reviews, and practical applications that drive progress in energy storage technologies. Researchers and professionals will find invaluable insights within its pages, contributing to both theoretical understanding and practical deployment of battery technologies. Open access provides broad dissemination of knowledge, ensuring that discoveries reach a global audience, and fostering collaborative efforts to address the challenges posed by modern energy demands.

MICROELECTRONICS JOURNAL

Pioneering Discoveries in Microelectronics and Beyond
Publisher: ELSEVIER SCI LTDISSN: 0026-2692Frequency: 12 issues/year

MICROELECTRONICS JOURNAL, published by Elsevier Sci Ltd since 1974, serves as a pivotal platform for disseminating cutting-edge research in the realms of microelectronics, nanotechnology, and materials science. With editions spanning from 1974 to 2024, the journal is well-respected within the scientific community, boasting a strong presence in key categories such as Atomic and Molecular Physics, Condensed Matter Physics, and Electrical and Electronic Engineering, as evidenced by its Q3 ranking in 2023. Researchers and professionals engaged in the exploration of electronic materials, optical applications, and nanoscale innovations can greatly benefit from the journal's insights, which situate their work within a robust academic framework. Although the journal does not currently offer open access, its rigorous peer-review process and high visibility in Scopus rankings—including a percentile ranking of 58th in Condensed Matter Physics—make it an essential resource for anyone looking to stay at the forefront of advancements in microelectronics and related fields.

MICROELECTRONICS RELIABILITY

Advancing the Future of Microelectronics Reliability
Publisher: PERGAMON-ELSEVIER SCIENCE LTDISSN: 0026-2714Frequency: 12 issues/year

MICROELECTRONICS RELIABILITY, published by PERGAMON-ELSEVIER SCIENCE LTD, is a pivotal journal that serves the advancing field of microelectronics and materials reliability. With its ISSN 0026-2714 and E-ISSN 1872-941X, this journal has been at the forefront of disseminating research since its inception in 1962 and is set to continue exploring cutting-edge topics through 2024. The journal holds a respectable presence across several categories, achieving a Q3 ranking in areas such as Atomic and Molecular Physics and Electrical and Electronic Engineering, highlighting its broad interdisciplinary appeal, while also ranking in the Q2 category for Safety, Risk, Reliability, and Quality, which speaks to its commitment to ensuring standards in technological advancements. Access to this journal is subscription-based, making it an essential resource for researchers, professionals, and students seeking reliable information and data regarding electronic material performance and reliability assessment. Located in Kidlington, Oxford, UK, MICROELECTRONICS RELIABILITY is dedicated to advancing the field and addressing the critical issues associated with the reliability of microelectronic devices, thereby supporting innovations that shape our technological future.

Journal of Control Science and Engineering

Connecting Research and Practice in Control Engineering
Publisher: HINDAWI LTDISSN: 1687-5249Frequency:

The Journal of Control Science and Engineering, published by HINDAWI LTD, is a prominent open-access journal that has been disseminating pioneering research since 2007. With its ISSN 1687-5249 and E-ISSN 1687-5257, the journal serves as a crucial platform for researchers, professionals, and students engaged in the fields of Computer Science Applications, Electrical and Electronic Engineering, and Modeling and Simulation. Holding a Q3 quartile ranking in 2023 across these categories, the journal maintains rigorous academic standards and is recognized for its contributions to advancing knowledge and technology in control science. The journal's current Scopus rankings highlight its significance, with impressive percentiles placing it within the top tier of its fields. Readers can access a wide range of high-quality research articles through its open access model, further establishing the journal as an essential resource for anyone seeking to broaden their understanding and application of control principles.

JOURNAL OF ELECTRONIC MATERIALS

Connecting Researchers to Groundbreaking Insights in Electronics
Publisher: SPRINGERISSN: 0361-5235Frequency: 12 issues/year

Welcome to the Journal of Electronic Materials, a premier publication in the field of materials science. Published by Springer, this esteemed journal has been a beacon for groundbreaking research in electronic, optical, and magnetic materials since its inception in 1972. As an established resource, it boasts a commendable impact factor and categorically ranks in the second quartile (Q2) in key areas such as Condensed Matter Physics and Electrical and Electronic Engineering, as well as holding a respectable third quartile ranking in fields related to Electronic, Optical, and Magnetic Materials and Materials Chemistry. Researchers, professionals, and students can access a wealth of knowledge as we publish original articles, reviews, and cutting-edge research that push the boundaries of science and technology in these critical fields. Stay informed and engaged as we explore advancements that shape the future of electronic materials.

MICROELECTRONICS INTERNATIONAL

Illuminating the path of microelectronics advancement.
Publisher: EMERALD GROUP PUBLISHING LTDISSN: 1356-5362Frequency: 3 issues/year

MICROELECTRONICS INTERNATIONAL is a distinguished peer-reviewed journal published by Emerald Group Publishing Ltd, focusing on the expansive domains of microelectronics, materials science, and physics. With its ISSN 1356-5362 and E-ISSN 1758-812X, the journal has been a critical platform for researchers since its inception in 1982. Although it currently holds a Q4 category ranking across multiple disciplines such as Atomic and Molecular Physics, Electronic Engineering, and Surfaces, Coatings and Films, it remains committed to advancing scholarship and fostering dialogue within these fields. The journal's scope encompasses innovative research and developments that contribute to the understanding and technological evolution of microelectronic materials and systems. While it doesn't offer open access, its content is accessible through various academic databases, enabling a broad audience of professionals and enthusiasts to engage with high-quality research findings. As microelectronics continues to play a pivotal role in shaping modern technology, MICROELECTRONICS INTERNATIONAL serves as an essential resource for advancing knowledge and inspiring future innovations.