JOURNAL OF ELECTRONIC PACKAGING

Scope & Guideline

Elevating Standards in Electronic Packaging Research

Introduction

Welcome to your portal for understanding JOURNAL OF ELECTRONIC PACKAGING, featuring guidelines for its aims and scope. Our guidelines cover trending and emerging topics, identifying the forefront of research. Additionally, we track declining topics, offering insights into areas experiencing reduced scholarly attention. Key highlights include highly cited topics and recently published papers, curated within these guidelines to assist you in navigating influential academic dialogues.
LanguageEnglish
ISSN1043-7398
PublisherASME
Support Open AccessNo
CountryUnited States
TypeJournal
Convergefrom 1989 to 2025
AbbreviationJ ELECTRON PACKAGING / J. Electron. Packag.
Frequency4 issues/year
Time To First Decision-
Time To Acceptance-
Acceptance Rate-
Home Page-
AddressTWO PARK AVE, NEW YORK, NY 10016-5990

Aims and Scopes

The JOURNAL OF ELECTRONIC PACKAGING focuses on the interdisciplinary field of electronic packaging, combining aspects of materials science, mechanical engineering, thermal management, and electrical engineering. The journal aims to publish cutting-edge research that contributes to the advancement of electronic packaging technologies, ensuring reliability and performance in electronic systems.
  1. Thermal Management Solutions:
    The journal emphasizes research related to innovative thermal management strategies, including liquid cooling, heat sink design, and thermal interface materials, aimed at enhancing the performance and reliability of electronic systems.
  2. Reliability and Failure Analysis:
    A core area of focus is the reliability of electronic components and systems. This encompasses studies on solder joint reliability, electromigration, and fatigue life under various operating conditions.
  3. Advanced Materials and Manufacturing Techniques:
    The exploration of new materials for electronic packaging, such as lead-free solders and nanocomposites, as well as advanced manufacturing techniques like additive manufacturing and aerosol jet printing, is a significant aspect of the journal.
  4. Modeling and Simulation:
    The journal publishes research that employs modeling and simulation techniques, including finite element analysis and machine learning, to predict thermal, mechanical, and electrical behaviors in electronic packaging.
  5. Heterogeneous Integration and Miniaturization:
    Research on heterogeneous integration methods and miniaturization techniques for electronic components, such as chiplets and 3D packaging, is highlighted to address the demand for smaller and more efficient electronic devices.
The JOURNAL OF ELECTRONIC PACKAGING has seen an increase in publications addressing several emerging themes that reflect contemporary challenges and advancements in the field. These trends indicate a shift towards more innovative and complex solutions in electronic packaging.
  1. Machine Learning and Artificial Intelligence Applications:
    There is a growing trend in the application of machine learning and AI for predictive modeling and optimization in electronic packaging. This includes fatigue life prediction and reliability assessments, indicating a merging of traditional engineering with data-driven approaches.
  2. Sustainability and Eco-Friendly Materials:
    Research focusing on sustainable materials and processes, such as lead-free solders and eco-friendly manufacturing methods, is gaining traction as the electronics industry moves towards greener practices.
  3. Advanced Cooling Technologies:
    Emerging cooling technologies, such as two-phase cooling and thermosyphon systems, are increasingly popular, reflecting the need for efficient thermal management solutions in high-density electronic applications.
  4. Integration of IoT and Smart Electronics:
    The integration of electronic packaging with IoT devices and smart technologies is on the rise, focusing on reliability and performance in connected systems, which is crucial for future advancements in consumer electronics.
  5. 3D Packaging and Chiplet Design:
    The trend towards 3D packaging and chiplet architectures is becoming more pronounced, driven by the demand for compact and high-performance electronic systems that support heterogeneous integration.

Declining or Waning

As the field of electronic packaging evolves, certain themes have experienced a decline in publication frequency. This section identifies these waning scopes, reflecting shifts in research interests and technological advancements.
  1. Traditional Soldering Techniques:
    Research focusing on conventional soldering methods has decreased, likely due to the industry’s shift towards lead-free and advanced soldering techniques that enhance reliability and performance.
  2. Low-Temperature Applications:
    There appears to be a waning interest in studies specifically targeting low-temperature applications, as more research is directed towards high-temperature stability and performance in electronics.
  3. Basic Thermal Analysis Methods:
    Fundamental thermal analysis methods are becoming less prominent, giving way to more sophisticated approaches that incorporate multi-physics modeling and advanced computational techniques.
  4. Electromechanical Systems:
    The focus on electromechanical systems within packaging has diminished, possibly due to a broader emphasis on integrated circuits and semiconductor devices that dominate the current landscape.

Similar Journals

MICROELECTRONICS INTERNATIONAL

Pioneering insights in microelectronics and beyond.
Publisher: EMERALD GROUP PUBLISHING LTDISSN: 1356-5362Frequency: 3 issues/year

MICROELECTRONICS INTERNATIONAL is a distinguished peer-reviewed journal published by Emerald Group Publishing Ltd, focusing on the expansive domains of microelectronics, materials science, and physics. With its ISSN 1356-5362 and E-ISSN 1758-812X, the journal has been a critical platform for researchers since its inception in 1982. Although it currently holds a Q4 category ranking across multiple disciplines such as Atomic and Molecular Physics, Electronic Engineering, and Surfaces, Coatings and Films, it remains committed to advancing scholarship and fostering dialogue within these fields. The journal's scope encompasses innovative research and developments that contribute to the understanding and technological evolution of microelectronic materials and systems. While it doesn't offer open access, its content is accessible through various academic databases, enabling a broad audience of professionals and enthusiasts to engage with high-quality research findings. As microelectronics continues to play a pivotal role in shaping modern technology, MICROELECTRONICS INTERNATIONAL serves as an essential resource for advancing knowledge and inspiring future innovations.

IEEE Open Journal of Industry Applications

Bridging theory and practice in industry applications.
Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCISSN: Frequency: 1 issue/year

IEEE Open Journal of Industry Applications is a premier open-access publication established in 2020 by the esteemed IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, dedicated to advancing the fields of Control and Systems Engineering, Electrical and Electronic Engineering, and Industrial and Manufacturing Engineering. With a strong commitment to disseminating high-quality research, the journal has rapidly garnered recognition, achieving a Q1 quartile ranking in multiple engineering categories, notably securing a rank of 21st out of 321 in Control and Systems Engineering and 26th out of 384 in Industrial and Manufacturing Engineering as of 2023. This journal not only facilitates immediate access to cutting-edge findings but also fosters an inclusive academic environment where researchers, professionals, and students can engage with and contribute to the evolving landscape of industry applications. By embracing open access, it ensures that pivotal research is freely available, thereby maximizing its impact on the scientific community. For potential contributors and readers, the journal's robust Scopus rankings—placing it in the top 7% of its fields—highlight its significance as a leading platform for innovative discussions and explorations in engineering.

PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS

Navigating the Frontiers of Materials Design and Application
Publisher: SAGE PUBLICATIONS LTDISSN: 1464-4207Frequency: 12 issues/year

PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS is a prestigious academic journal published by SAGE PUBLICATIONS LTD, focusing on the dynamic fields of mechanical engineering and materials science. With an impressive impact factor reflective of its rigorous scholarly contributions, this journal serves as a vital platform for the dissemination of innovative research and practical applications in materials design and engineering processes. Since its inception in 1999 and continuing through 2024, it has maintained a robust reputation, achieving a Q2 ranking in both Materials Science (miscellaneous) and Mechanical Engineering categories, as well as commendable Scopus ranks that place it in the top percentiles of its fields. Located in the United Kingdom, the journal encourages submissions from researchers and professionals who are seeking to advance their understanding of materials applications while fostering interdisciplinary collaboration. Although it currently operates under traditional access terms, the journal prioritizes impactful research that addresses contemporary challenges in design and manufacturing, ensuring that it remains a must-read for anyone invested in the innovations shaping our technological landscape.

Korean Journal of Metals and Materials

Advancing the Frontiers of Metals and Materials Science
Publisher: KOREAN INST METALS MATERIALSISSN: 1738-8228Frequency: 10 issues/year

Welcome to the Korean Journal of Metals and Materials, a premier publication dedicated to advancing research in the interdisciplinary fields of metals and materials science. Published by the Korean Institute of Metals and Materials, this journal aims to foster the dissemination of innovative findings and significant developments across various domains, including electronic, optical, and magnetic materials, metals and alloys, as well as modeling, simulation, and surface coatings. With a commendable Q3 quartile ranking in several relevant categories as of 2023, it serves as a vital resource for researchers, professionals, and students interested in the latest scientific trends and technological applications. The journal has successfully converged from 2007 to 2024, showcasing a rich archive of knowledge. Engaging with this publication gives readers the opportunity to stay updated with critical advancements and enhances collaboration within the vibrant materials science community. Access is available through various platforms, ensuring that our content is widely accessible to all those striving for excellence in the field.

MICROELECTRONICS RELIABILITY

Commitment to Quality in Microelectronics Research
Publisher: PERGAMON-ELSEVIER SCIENCE LTDISSN: 0026-2714Frequency: 12 issues/year

MICROELECTRONICS RELIABILITY, published by PERGAMON-ELSEVIER SCIENCE LTD, is a pivotal journal that serves the advancing field of microelectronics and materials reliability. With its ISSN 0026-2714 and E-ISSN 1872-941X, this journal has been at the forefront of disseminating research since its inception in 1962 and is set to continue exploring cutting-edge topics through 2024. The journal holds a respectable presence across several categories, achieving a Q3 ranking in areas such as Atomic and Molecular Physics and Electrical and Electronic Engineering, highlighting its broad interdisciplinary appeal, while also ranking in the Q2 category for Safety, Risk, Reliability, and Quality, which speaks to its commitment to ensuring standards in technological advancements. Access to this journal is subscription-based, making it an essential resource for researchers, professionals, and students seeking reliable information and data regarding electronic material performance and reliability assessment. Located in Kidlington, Oxford, UK, MICROELECTRONICS RELIABILITY is dedicated to advancing the field and addressing the critical issues associated with the reliability of microelectronic devices, thereby supporting innovations that shape our technological future.

RARE METAL MATERIALS AND ENGINEERING

Unlocking the Potential of Advanced Materials
Publisher: NORTHWEST INST NONFERROUS METAL RESEARCHISSN: 1002-185XFrequency: 12 issues/year

RARE METAL MATERIALS AND ENGINEERING is a vital academic journal dedicated to advancing the fields of materials science, engineering, and metallurgy. Published by the NORTHWEST INST NONFERROUS METAL RESEARCH in China, this journal has been an essential resource for researchers and professionals since its inception in 1993. With a focus on rare metals and their engineering applications, the journal addresses contemporary issues and innovations in materials chemistry and electronic engineering, providing insights into the properties and uses of advanced materials. Although it currently falls within the Q4 category for several categories, including Electrical and Electronic Engineering and Materials Chemistry, its commitment to quality and relevance in the field is evident. The journal offers a platform for researchers to share their findings with the scientific community, fostering collaboration and knowledge exchange in an important area of study. Researchers and students interested in exploring the latest in rare metal technologies and engineering methodologies will find this journal a valuable addition to their academic library.

COMPOSITES SCIENCE AND TECHNOLOGY

Advancing the Future of Composite Materials
Publisher: ELSEVIER SCI LTDISSN: 0266-3538Frequency: 16 issues/year

Composites Science and Technology, a premier journal published by Elsevier Sci Ltd, serves as a vital resource in the fields of composite materials and engineering. With an impressive 2023 impact factor reflecting its influential contributions, this journal has established itself within the top tier of academic publishing, flaunting a Q1 ranking in both the Ceramics and Composites and Engineering (Miscellaneous) categories. Covering a diverse range of topics from the development of novel composite materials to their practical applications across various industries, it is recognized for its rigorous peer-review process and high-quality research outputs. As reflected in its Scopus rankings, Composites Science and Technology places in the 97th percentile among general engineering journals and the 94th percentile amongst ceramics and composites science literature. Researchers and professionals alike benefit from its comprehensive access to cutting-edge discoveries and advancements, making it an indispensable tool for driving innovation within this dynamic field.

SOLDERING & SURFACE MOUNT TECHNOLOGY

Advancing Innovations in Soldering and Surface Mount Technology
Publisher: EMERALD GROUP PUBLISHING LTDISSN: 0954-0911Frequency: 4 issues/year

SOLDERING & SURFACE MOUNT TECHNOLOGY is a prominent peer-reviewed journal published by Emerald Group Publishing Ltd in the United Kingdom, showcasing its commitment to advancing the fields of Electrical and Electronic Engineering, Condensed Matter Physics, and Materials Science. With a strong publication history dating back to 1989 and continuing through 2024, this journal provides a vital platform for disseminating innovative research and technological developments in soldering and surface mount technology. It holds a respectable ranking within its categories, including a Q3 classification in multiple fields according to the 2023 category quartiles, with Scopus rankings reflecting its growing influence in the academic community (e.g., #316/797 in Electrical and Electronic Engineering). While this journal does not offer open access, it remains an essential resource for researchers, practitioners, and students who aim to stay informed about cutting-edge advancements and trends in this dynamic area of study. By focusing on high-quality research contributions, SOLDERING & SURFACE MOUNT TECHNOLOGY continues to play a crucial role in fostering innovation and knowledge exchange within its scope.

JOURNAL OF ELECTRONIC MATERIALS

Pioneering Discoveries in Electronic, Optical, and Magnetic Materials
Publisher: SPRINGERISSN: 0361-5235Frequency: 12 issues/year

Welcome to the Journal of Electronic Materials, a premier publication in the field of materials science. Published by Springer, this esteemed journal has been a beacon for groundbreaking research in electronic, optical, and magnetic materials since its inception in 1972. As an established resource, it boasts a commendable impact factor and categorically ranks in the second quartile (Q2) in key areas such as Condensed Matter Physics and Electrical and Electronic Engineering, as well as holding a respectable third quartile ranking in fields related to Electronic, Optical, and Magnetic Materials and Materials Chemistry. Researchers, professionals, and students can access a wealth of knowledge as we publish original articles, reviews, and cutting-edge research that push the boundaries of science and technology in these critical fields. Stay informed and engaged as we explore advancements that shape the future of electronic materials.

MICROELECTRONICS JOURNAL

Advancing the Frontiers of Microelectronics Research
Publisher: ELSEVIER SCI LTDISSN: 0026-2692Frequency: 12 issues/year

MICROELECTRONICS JOURNAL, published by Elsevier Sci Ltd since 1974, serves as a pivotal platform for disseminating cutting-edge research in the realms of microelectronics, nanotechnology, and materials science. With editions spanning from 1974 to 2024, the journal is well-respected within the scientific community, boasting a strong presence in key categories such as Atomic and Molecular Physics, Condensed Matter Physics, and Electrical and Electronic Engineering, as evidenced by its Q3 ranking in 2023. Researchers and professionals engaged in the exploration of electronic materials, optical applications, and nanoscale innovations can greatly benefit from the journal's insights, which situate their work within a robust academic framework. Although the journal does not currently offer open access, its rigorous peer-review process and high visibility in Scopus rankings—including a percentile ranking of 58th in Condensed Matter Physics—make it an essential resource for anyone looking to stay at the forefront of advancements in microelectronics and related fields.