JOURNAL OF ELECTRONIC PACKAGING

Scope & Guideline

Exploring the Frontiers of Electronic Engineering

Introduction

Delve into the academic richness of JOURNAL OF ELECTRONIC PACKAGING with our guidelines, detailing its aims and scope. Our resource identifies emerging and trending topics paving the way for new academic progress. We also provide insights into declining or waning topics, helping you stay informed about changing research landscapes. Evaluate highly cited topics and recent publications within these guidelines to align your work with influential scholarly trends.
LanguageEnglish
ISSN1043-7398
PublisherASME
Support Open AccessNo
CountryUnited States
TypeJournal
Convergefrom 1989 to 2025
AbbreviationJ ELECTRON PACKAGING / J. Electron. Packag.
Frequency4 issues/year
Time To First Decision-
Time To Acceptance-
Acceptance Rate-
Home Page-
AddressTWO PARK AVE, NEW YORK, NY 10016-5990

Aims and Scopes

The JOURNAL OF ELECTRONIC PACKAGING focuses on the interdisciplinary field of electronic packaging, combining aspects of materials science, mechanical engineering, thermal management, and electrical engineering. The journal aims to publish cutting-edge research that contributes to the advancement of electronic packaging technologies, ensuring reliability and performance in electronic systems.
  1. Thermal Management Solutions:
    The journal emphasizes research related to innovative thermal management strategies, including liquid cooling, heat sink design, and thermal interface materials, aimed at enhancing the performance and reliability of electronic systems.
  2. Reliability and Failure Analysis:
    A core area of focus is the reliability of electronic components and systems. This encompasses studies on solder joint reliability, electromigration, and fatigue life under various operating conditions.
  3. Advanced Materials and Manufacturing Techniques:
    The exploration of new materials for electronic packaging, such as lead-free solders and nanocomposites, as well as advanced manufacturing techniques like additive manufacturing and aerosol jet printing, is a significant aspect of the journal.
  4. Modeling and Simulation:
    The journal publishes research that employs modeling and simulation techniques, including finite element analysis and machine learning, to predict thermal, mechanical, and electrical behaviors in electronic packaging.
  5. Heterogeneous Integration and Miniaturization:
    Research on heterogeneous integration methods and miniaturization techniques for electronic components, such as chiplets and 3D packaging, is highlighted to address the demand for smaller and more efficient electronic devices.
The JOURNAL OF ELECTRONIC PACKAGING has seen an increase in publications addressing several emerging themes that reflect contemporary challenges and advancements in the field. These trends indicate a shift towards more innovative and complex solutions in electronic packaging.
  1. Machine Learning and Artificial Intelligence Applications:
    There is a growing trend in the application of machine learning and AI for predictive modeling and optimization in electronic packaging. This includes fatigue life prediction and reliability assessments, indicating a merging of traditional engineering with data-driven approaches.
  2. Sustainability and Eco-Friendly Materials:
    Research focusing on sustainable materials and processes, such as lead-free solders and eco-friendly manufacturing methods, is gaining traction as the electronics industry moves towards greener practices.
  3. Advanced Cooling Technologies:
    Emerging cooling technologies, such as two-phase cooling and thermosyphon systems, are increasingly popular, reflecting the need for efficient thermal management solutions in high-density electronic applications.
  4. Integration of IoT and Smart Electronics:
    The integration of electronic packaging with IoT devices and smart technologies is on the rise, focusing on reliability and performance in connected systems, which is crucial for future advancements in consumer electronics.
  5. 3D Packaging and Chiplet Design:
    The trend towards 3D packaging and chiplet architectures is becoming more pronounced, driven by the demand for compact and high-performance electronic systems that support heterogeneous integration.

Declining or Waning

As the field of electronic packaging evolves, certain themes have experienced a decline in publication frequency. This section identifies these waning scopes, reflecting shifts in research interests and technological advancements.
  1. Traditional Soldering Techniques:
    Research focusing on conventional soldering methods has decreased, likely due to the industry’s shift towards lead-free and advanced soldering techniques that enhance reliability and performance.
  2. Low-Temperature Applications:
    There appears to be a waning interest in studies specifically targeting low-temperature applications, as more research is directed towards high-temperature stability and performance in electronics.
  3. Basic Thermal Analysis Methods:
    Fundamental thermal analysis methods are becoming less prominent, giving way to more sophisticated approaches that incorporate multi-physics modeling and advanced computational techniques.
  4. Electromechanical Systems:
    The focus on electromechanical systems within packaging has diminished, possibly due to a broader emphasis on integrated circuits and semiconductor devices that dominate the current landscape.

Similar Journals

JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME

Unlocking the potential of materials science for global advancement.
Publisher: ASMEISSN: 0094-4289Frequency: 4 issues/year

JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME is a premier journal published by the American Society of Mechanical Engineers (ASME), dedicated to advancing the field of engineering materials and technology. With an ISSN of 0094-4289 and E-ISSN 1528-8889, this journal has provided invaluable insights since its inception in 1973. Operating from its headquarters in New York, United States, it serves a global audience of researchers, professionals, and students alike. The journal is recognized for its rigorous peer-review process and its commitment to disseminating high-quality research, currently holding a Q3 quartile ranking across multiple categories including Condensed Matter Physics, Materials Science, Mechanical Engineering, and Mechanics of Materials. With a focus on exploring innovative materials and their applications, it aims to foster collaboration and discovery in the engineering community. Although it is not an open-access journal, it continues to play a vital role in shaping the future of engineering materials research up to 2024. Researchers and practitioners will find in this journal a significant platform to support the development and understanding of engineering materials, making contributions that resonate through academia and industry.

Batteries-Basel

Driving Progress in Electrochemical Innovations
Publisher: MDPIISSN: Frequency: 12 issues/year

Batteries-Basel, published by MDPI, is a premier open-access journal since 2015 that aims to serve the growing community focused on the technological advancements and innovations in battery science and related fields. Operating from its base in Switzerland, this journal publishes high-quality research covering the fields of Electrical and Electronic Engineering, Electrochemistry, and Energy Engineering and Power Technology. With a commendable Q2 ranking in multiple categories for 2023, it consistently strives to present cutting-edge studies, reviews, and practical applications that drive progress in energy storage technologies. Researchers and professionals will find invaluable insights within its pages, contributing to both theoretical understanding and practical deployment of battery technologies. Open access provides broad dissemination of knowledge, ensuring that discoveries reach a global audience, and fostering collaborative efforts to address the challenges posed by modern energy demands.

MICROELECTRONICS INTERNATIONAL

Shaping tomorrow's technology with today's research.
Publisher: EMERALD GROUP PUBLISHING LTDISSN: 1356-5362Frequency: 3 issues/year

MICROELECTRONICS INTERNATIONAL is a distinguished peer-reviewed journal published by Emerald Group Publishing Ltd, focusing on the expansive domains of microelectronics, materials science, and physics. With its ISSN 1356-5362 and E-ISSN 1758-812X, the journal has been a critical platform for researchers since its inception in 1982. Although it currently holds a Q4 category ranking across multiple disciplines such as Atomic and Molecular Physics, Electronic Engineering, and Surfaces, Coatings and Films, it remains committed to advancing scholarship and fostering dialogue within these fields. The journal's scope encompasses innovative research and developments that contribute to the understanding and technological evolution of microelectronic materials and systems. While it doesn't offer open access, its content is accessible through various academic databases, enabling a broad audience of professionals and enthusiasts to engage with high-quality research findings. As microelectronics continues to play a pivotal role in shaping modern technology, MICROELECTRONICS INTERNATIONAL serves as an essential resource for advancing knowledge and inspiring future innovations.

Journal of Control Science and Engineering

Pioneering Research for a Smarter, Controlled Future
Publisher: HINDAWI LTDISSN: 1687-5249Frequency:

The Journal of Control Science and Engineering, published by HINDAWI LTD, is a prominent open-access journal that has been disseminating pioneering research since 2007. With its ISSN 1687-5249 and E-ISSN 1687-5257, the journal serves as a crucial platform for researchers, professionals, and students engaged in the fields of Computer Science Applications, Electrical and Electronic Engineering, and Modeling and Simulation. Holding a Q3 quartile ranking in 2023 across these categories, the journal maintains rigorous academic standards and is recognized for its contributions to advancing knowledge and technology in control science. The journal's current Scopus rankings highlight its significance, with impressive percentiles placing it within the top tier of its fields. Readers can access a wide range of high-quality research articles through its open access model, further establishing the journal as an essential resource for anyone seeking to broaden their understanding and application of control principles.

Korean Journal of Metals and Materials

Advancing the Frontiers of Metals and Materials Science
Publisher: KOREAN INST METALS MATERIALSISSN: 1738-8228Frequency: 10 issues/year

Welcome to the Korean Journal of Metals and Materials, a premier publication dedicated to advancing research in the interdisciplinary fields of metals and materials science. Published by the Korean Institute of Metals and Materials, this journal aims to foster the dissemination of innovative findings and significant developments across various domains, including electronic, optical, and magnetic materials, metals and alloys, as well as modeling, simulation, and surface coatings. With a commendable Q3 quartile ranking in several relevant categories as of 2023, it serves as a vital resource for researchers, professionals, and students interested in the latest scientific trends and technological applications. The journal has successfully converged from 2007 to 2024, showcasing a rich archive of knowledge. Engaging with this publication gives readers the opportunity to stay updated with critical advancements and enhances collaboration within the vibrant materials science community. Access is available through various platforms, ensuring that our content is widely accessible to all those striving for excellence in the field.

PACKAGING TECHNOLOGY AND SCIENCE

Transforming Ideas into Innovative Packaging Solutions
Publisher: WILEYISSN: 0894-3214Frequency: 12 issues/year

PACKAGING TECHNOLOGY AND SCIENCE, published by Wiley, is a leading journal in the fields of packaging technology, materials science, and mechanical engineering. With a dedicated focus on innovative research and advancements in packaging materials and methodologies, the journal has made significant contributions since its inception in 1988. It holds a distinguished position as a Q2 journal in multiple disciplines, including Chemistry, Materials Science, and Mechanical Engineering, reflecting its high impact and scholarly influence. Although not an Open Access publication, it reaches a broad audience through its rigorous peer-review process and commitment to disseminating critical findings in packaging research. Researchers, professionals, and students alike benefit from the journal’s rich content that encourages interdisciplinary collaboration and the exploration of sustainable packaging solutions. For those seeking to remain at the forefront of packaging technology and science, this journal serves as an essential resource for fostering innovation and addressing the evolving challenges within the industry.

STROJNISKI VESTNIK-JOURNAL OF MECHANICAL ENGINEERING

Advancing Mechanical Engineering Knowledge Since 1974
Publisher: ASSOC MECHANICAL ENGINEERS TECHNICIANS SLOVENIAISSN: 0039-2480Frequency: 12 issues/year

STROJNISKI VESTNIK-JOURNAL OF MECHANICAL ENGINEERING is a prestigious publication that has been disseminating cutting-edge research in the field of mechanical engineering since 1974. Published by the Association of Mechanical Engineers Technicians Slovenia, this journal serves as a critical platform for professionals, researchers, and students aiming to explore advancements in mechanical engineering and mechanics of materials. With a category ranking in the Q3 quartile for both Mechanical Engineering and Mechanics of Materials, the journal reflects a robust engagement with contemporary research and practices, contributing to the ongoing discourse within these vital disciplines. Although currently not open access, the journal is committed to providing high-quality, peer-reviewed articles that facilitate knowledge sharing and innovation. It is indexed in Scopus, maintaining respectable standings within its categories, thereby underlining its importance and impact in the global academic community.

RARE METAL MATERIALS AND ENGINEERING

Shaping the Future of Metallurgy and Engineering
Publisher: NORTHWEST INST NONFERROUS METAL RESEARCHISSN: 1002-185XFrequency: 12 issues/year

RARE METAL MATERIALS AND ENGINEERING is a vital academic journal dedicated to advancing the fields of materials science, engineering, and metallurgy. Published by the NORTHWEST INST NONFERROUS METAL RESEARCH in China, this journal has been an essential resource for researchers and professionals since its inception in 1993. With a focus on rare metals and their engineering applications, the journal addresses contemporary issues and innovations in materials chemistry and electronic engineering, providing insights into the properties and uses of advanced materials. Although it currently falls within the Q4 category for several categories, including Electrical and Electronic Engineering and Materials Chemistry, its commitment to quality and relevance in the field is evident. The journal offers a platform for researchers to share their findings with the scientific community, fostering collaboration and knowledge exchange in an important area of study. Researchers and students interested in exploring the latest in rare metal technologies and engineering methodologies will find this journal a valuable addition to their academic library.

Frontiers in Mechanical Engineering-Switzerland

Driving Breakthroughs in Engineering Science
Publisher: FRONTIERS MEDIA SAISSN: Frequency: 1 issue/year

Frontiers in Mechanical Engineering-Switzerland, published by FRONTIERS MEDIA SA, is a pioneering open-access journal that has been fostering innovations in the field of mechanical engineering since its inception in 2015. Based in Switzerland, this journal provides a robust platform for disseminating cutting-edge research across multiple disciplines within mechanical engineering, including materials science, industrial and manufacturing engineering, and computer science applications. With impressive Scopus rankings, including Q2 statuses in key categories such as Industrial and Manufacturing Engineering and Mechanical Engineering, it stands out as a valuable resource for researchers and practitioners aiming to stay abreast of trends and breakthroughs in these fields. By embracing open-access principles, the journal ensures that high-quality research is readily available to a global audience, thereby promoting collaboration and knowledge sharing. As it continues to grow, Frontiers in Mechanical Engineering is poised to make significant contributions to both academic and professional communities, enhancing understanding and advancing practices in engineering disciplines.

PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS

Unveiling Cutting-Edge Research in Materials Applications
Publisher: SAGE PUBLICATIONS LTDISSN: 1464-4207Frequency: 12 issues/year

PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS is a prestigious academic journal published by SAGE PUBLICATIONS LTD, focusing on the dynamic fields of mechanical engineering and materials science. With an impressive impact factor reflective of its rigorous scholarly contributions, this journal serves as a vital platform for the dissemination of innovative research and practical applications in materials design and engineering processes. Since its inception in 1999 and continuing through 2024, it has maintained a robust reputation, achieving a Q2 ranking in both Materials Science (miscellaneous) and Mechanical Engineering categories, as well as commendable Scopus ranks that place it in the top percentiles of its fields. Located in the United Kingdom, the journal encourages submissions from researchers and professionals who are seeking to advance their understanding of materials applications while fostering interdisciplinary collaboration. Although it currently operates under traditional access terms, the journal prioritizes impactful research that addresses contemporary challenges in design and manufacturing, ensuring that it remains a must-read for anyone invested in the innovations shaping our technological landscape.