Welcome to the Korean Journal of Metals and Materials, a premier publication dedicated to advancing research in the interdisciplinary fields of metals and materials science. Published by the Korean Institute of Metals and Materials, this journal aims to foster the dissemination of innovative findings and significant developments across various domains, including electronic, optical, and magnetic materials, metals and alloys, as well as modeling, simulation, and surface coatings. With a commendable Q3 quartile ranking in several relevant categories as of 2023, it serves as a vital resource for researchers, professionals, and students interested in the latest scientific trends and technological applications. The journal has successfully converged from 2007 to 2024, showcasing a rich archive of knowledge. Engaging with this publication gives readers the opportunity to stay updated with critical advancements and enhances collaboration within the vibrant materials science community. Access is available through various platforms, ensuring that our content is widely accessible to all those striving for excellence in the field.

PACKAGING TECHNOLOGY AND SCIENCE, published by Wiley, is a leading journal in the fields of packaging technology, materials science, and mechanical engineering. With a dedicated focus on innovative research and advancements in packaging materials and methodologies, the journal has made significant contributions since its inception in 1988. It holds a distinguished position as a Q2 journal in multiple disciplines, including Chemistry, Materials Science, and Mechanical Engineering, reflecting its high impact and scholarly influence. Although not an Open Access publication, it reaches a broad audience through its rigorous peer-review process and commitment to disseminating critical findings in packaging research. Researchers, professionals, and students alike benefit from the journal’s rich content that encourages interdisciplinary collaboration and the exploration of sustainable packaging solutions. For those seeking to remain at the forefront of packaging technology and science, this journal serves as an essential resource for fostering innovation and addressing the evolving challenges within the industry.

EXPERIMENTAL HEAT TRANSFER, published by Taylor & Francis Inc, is a leading journal in the fields of heat transfer, control and systems engineering, and instrumentation, with a strong impact factor evidenced by its placement in the second quartile (Q2) for relevant categories as of 2023. With ISSN 0891-6152 and E-ISSN 1521-0480, the journal has been an essential platform for researchers since its inception in 1987, facilitating the dissemination of innovative research, experimental methods, and advancements in thermal engineering. This journal, based in the United Kingdom, focuses on both applied and theoretical aspects of heat transfer, engaging a diverse audience of professionals and students keen on the latest scientific breakthroughs in the domain. With its solid Scopus rankings, including being in the top 76th percentile in Physics and Astronomy: Instrumentation, EXPERIMENTAL HEAT TRANSFER continues to be a vital resource for advancing knowledge and fostering collaboration among the academic community.

Composites Science and Technology, a premier journal published by Elsevier Sci Ltd, serves as a vital resource in the fields of composite materials and engineering. With an impressive 2023 impact factor reflecting its influential contributions, this journal has established itself within the top tier of academic publishing, flaunting a Q1 ranking in both the Ceramics and Composites and Engineering (Miscellaneous) categories. Covering a diverse range of topics from the development of novel composite materials to their practical applications across various industries, it is recognized for its rigorous peer-review process and high-quality research outputs. As reflected in its Scopus rankings, Composites Science and Technology places in the 97th percentile among general engineering journals and the 94th percentile amongst ceramics and composites science literature. Researchers and professionals alike benefit from its comprehensive access to cutting-edge discoveries and advancements, making it an indispensable tool for driving innovation within this dynamic field.

Functional Composites and Structures is a prestigious academic journal published by IOP Publishing Ltd, dedicated to advancing the field of materials science with a focus on innovative composite materials and their structural applications. Established in 2019 and running through 2024, this journal uniquely bridges several disciplines, consistently ranking in the Q2 quartile across key categories including Ceramics and Composites, Electronic, Optical and Magnetic Materials, and Mechanics of Materials. With a commendable Scopus rank that places it within the top tiers of its field, the journal is instrumental for researchers, engineers, and scholars seeking to explore the latest developments in material properties, functionality, and applications. Although access options are not specified, the open-access nature of the journal promotes wider dissemination and engagement with cutting-edge research. As the demand for smarter, more efficient materials continues to grow, Functional Composites and Structures serves as a vital resource for fostering collaboration and driving innovation in material sciences.

MICROELECTRONICS INTERNATIONAL is a distinguished peer-reviewed journal published by Emerald Group Publishing Ltd, focusing on the expansive domains of microelectronics, materials science, and physics. With its ISSN 1356-5362 and E-ISSN 1758-812X, the journal has been a critical platform for researchers since its inception in 1982. Although it currently holds a Q4 category ranking across multiple disciplines such as Atomic and Molecular Physics, Electronic Engineering, and Surfaces, Coatings and Films, it remains committed to advancing scholarship and fostering dialogue within these fields. The journal's scope encompasses innovative research and developments that contribute to the understanding and technological evolution of microelectronic materials and systems. While it doesn't offer open access, its content is accessible through various academic databases, enabling a broad audience of professionals and enthusiasts to engage with high-quality research findings. As microelectronics continues to play a pivotal role in shaping modern technology, MICROELECTRONICS INTERNATIONAL serves as an essential resource for advancing knowledge and inspiring future innovations.

MICROELECTRONICS RELIABILITY, published by PERGAMON-ELSEVIER SCIENCE LTD, is a pivotal journal that serves the advancing field of microelectronics and materials reliability. With its ISSN 0026-2714 and E-ISSN 1872-941X, this journal has been at the forefront of disseminating research since its inception in 1962 and is set to continue exploring cutting-edge topics through 2024. The journal holds a respectable presence across several categories, achieving a Q3 ranking in areas such as Atomic and Molecular Physics and Electrical and Electronic Engineering, highlighting its broad interdisciplinary appeal, while also ranking in the Q2 category for Safety, Risk, Reliability, and Quality, which speaks to its commitment to ensuring standards in technological advancements. Access to this journal is subscription-based, making it an essential resource for researchers, professionals, and students seeking reliable information and data regarding electronic material performance and reliability assessment. Located in Kidlington, Oxford, UK, MICROELECTRONICS RELIABILITY is dedicated to advancing the field and addressing the critical issues associated with the reliability of microelectronic devices, thereby supporting innovations that shape our technological future.

RARE METAL MATERIALS AND ENGINEERING is a vital academic journal dedicated to advancing the fields of materials science, engineering, and metallurgy. Published by the NORTHWEST INST NONFERROUS METAL RESEARCH in China, this journal has been an essential resource for researchers and professionals since its inception in 1993. With a focus on rare metals and their engineering applications, the journal addresses contemporary issues and innovations in materials chemistry and electronic engineering, providing insights into the properties and uses of advanced materials. Although it currently falls within the Q4 category for several categories, including Electrical and Electronic Engineering and Materials Chemistry, its commitment to quality and relevance in the field is evident. The journal offers a platform for researchers to share their findings with the scientific community, fostering collaboration and knowledge exchange in an important area of study. Researchers and students interested in exploring the latest in rare metal technologies and engineering methodologies will find this journal a valuable addition to their academic library.

IEEE Transactions on Device and Materials Reliability stands as a leading journal in the field of reliability engineering, specializing in the intricate connections between device performance and materials efficacy. Published by the renowned IEEE-Institute of Electrical and Electronics Engineers Inc., this journal boasts a commendable impact factor and exhibits robust Scopus rankings across various categories, including electrical and electronic engineering and safety, risk, reliability, and quality. With a publication timeline from 2001 to 2024, it serves as an essential resource for researchers and professionals alike, providing comprehensive insights into current advancements and challenges in device reliability and materials science. Although it operates under a subscription model, the journal's extensive contributions are crucial for fostering significant innovations that ensure the integrity and longevity of electronic devices in a rapidly evolving technological landscape. Researchers, professionals, and students delving into this vital domain will find IEEE Transactions on Device and Materials Reliability a valuable platform to disseminate their findings and explore the latest trends.

Multidiscipline Modeling in Materials and Structures, published by EMERALD GROUP PUBLISHING LTD, serves as a vital platform at the intersection of diverse fields including materials science, mechanical engineering, and modeling and simulation. Since its inception in 2005, this journal has gained recognition for its commitment to advancing knowledge and innovation within these disciplines, boasting a commendable Q3 categorization across multiple fields as of 2023. With a robust Scopus ranking that places it in the top 60th percentile for both mechanical engineering and mechanics of materials, it stands as a credible source for researchers and practitioners seeking to stay informed on the latest methodologies and applications. The journal emphasizes the importance of collaborative approaches to complex problems in materials and structural analysis, aiming to foster interdisciplinary dialogue and generate impactful research outcomes. Although currently not open access, the journal offers subscription options that ensure access to cutting-edge studies and critical reviews relevant to professionals and students alike. Engaging with this journal not only enriches one’s understanding of the field but also contributes to the ongoing discourse and development of innovative solutions in materials and structural modeling.