JOURNAL OF ELECTRONIC PACKAGING

metrics 2024

Fostering Collaboration Across Engineering Disciplines

Introduction

JOURNAL OF ELECTRONIC PACKAGING, published by the esteemed American Society of Mechanical Engineers (ASME), is a pivotal platform for research in the fields of Computer Science Applications, Electrical and Electronic Engineering, and Materials Science, particularly focusing on electronic packaging technologies. With an ISSN of 1043-7398 and an E-ISSN of 1528-9044, this journal has consistently showcased groundbreaking studies since its inception in 1989, projected to continue until 2025. Recognized within the Q2 quartile rankings across multiple categories in the 2023 Scopus rankings, it maintains a strong presence in the academic community with notable rankings in various engineering and materials science domains. This journal serves as a critical resource for researchers, professionals, and students who seek to advance their understanding and application of innovative electronic packaging solutions. Though it does not offer open access, it encompasses a robust array of high-quality articles that foster knowledge advancement and interdisciplinary collaboration in a rapidly evolving technological landscape, ultimately contributing to the growth and sophistication of the electronic packaging field.

Metrics 2024

SCIMAGO Journal Rank0.61
Journal Impact Factor2.20
Journal Impact Factor (5 years)2.10
H-Index60
Journal IF Without Self2.20
Eigen Factor0.00
Normal Eigen Factor0.23
Influence0.45
Immediacy Index0.90
Cited Half Life8.10
Citing Half Life8.10
JCI0.49
Total Documents1484
WOS Total Citations1644
SCIMAGO Total Citations6805
SCIMAGO SELF Citations714
Scopus Journal Rank0.61
Cites / Document (2 Years)2.34
Cites / Document (3 Years)2.24
Cites / Document (4 Years)2.33

Metrics History

Rank 2024

Scopus

Electrical and Electronic Engineering in Engineering
Rank #267/797
Percentile 66.50
Quartile Q2
Mechanics of Materials in Engineering
Rank #134/398
Percentile 66.33
Quartile Q2
Electronic, Optical and Magnetic Materials in Materials Science
Rank #100/284
Percentile 64.79
Quartile Q2
Computer Science Applications in Computer Science
Rank #322/817
Percentile 60.59
Quartile Q2

IF (Web Of Science)

ENGINEERING, ELECTRICAL & ELECTRONIC
Rank 183/352
Percentile 48.20
Quartile Q3
ENGINEERING, MECHANICAL
Rank 75/180
Percentile 58.60
Quartile Q2

JCI (Web Of Science)

ENGINEERING, ELECTRICAL & ELECTRONIC
Rank 195/354
Percentile 44.92
Quartile Q3
ENGINEERING, MECHANICAL
Rank 92/180
Percentile 48.89
Quartile Q3

Quartile History

Similar Journals

PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS

Advancing Innovation in Materials Design and Engineering
Publisher: SAGE PUBLICATIONS LTDISSN: 1464-4207Frequency: 12 issues/year

PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS is a prestigious academic journal published by SAGE PUBLICATIONS LTD, focusing on the dynamic fields of mechanical engineering and materials science. With an impressive impact factor reflective of its rigorous scholarly contributions, this journal serves as a vital platform for the dissemination of innovative research and practical applications in materials design and engineering processes. Since its inception in 1999 and continuing through 2024, it has maintained a robust reputation, achieving a Q2 ranking in both Materials Science (miscellaneous) and Mechanical Engineering categories, as well as commendable Scopus ranks that place it in the top percentiles of its fields. Located in the United Kingdom, the journal encourages submissions from researchers and professionals who are seeking to advance their understanding of materials applications while fostering interdisciplinary collaboration. Although it currently operates under traditional access terms, the journal prioritizes impactful research that addresses contemporary challenges in design and manufacturing, ensuring that it remains a must-read for anyone invested in the innovations shaping our technological landscape.

Frontiers in Mechanical Engineering-Switzerland

Advancing Innovations in Mechanical Engineering
Publisher: FRONTIERS MEDIA SAISSN: Frequency: 1 issue/year

Frontiers in Mechanical Engineering-Switzerland, published by FRONTIERS MEDIA SA, is a pioneering open-access journal that has been fostering innovations in the field of mechanical engineering since its inception in 2015. Based in Switzerland, this journal provides a robust platform for disseminating cutting-edge research across multiple disciplines within mechanical engineering, including materials science, industrial and manufacturing engineering, and computer science applications. With impressive Scopus rankings, including Q2 statuses in key categories such as Industrial and Manufacturing Engineering and Mechanical Engineering, it stands out as a valuable resource for researchers and practitioners aiming to stay abreast of trends and breakthroughs in these fields. By embracing open-access principles, the journal ensures that high-quality research is readily available to a global audience, thereby promoting collaboration and knowledge sharing. As it continues to grow, Frontiers in Mechanical Engineering is poised to make significant contributions to both academic and professional communities, enhancing understanding and advancing practices in engineering disciplines.

ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS

Fostering Excellence in Design Automation and Engineering
Publisher: ASSOC COMPUTING MACHINERYISSN: 1084-4309Frequency: 6 issues/year

ACM Transactions on Design Automation of Electronic Systems is a premier scholarly journal published by the Association for Computing Machinery (ACM), dedicated to advancing the field of electronic system design automation. With an impact factor that reflects its influential contributions, this journal serves as an essential resource for researchers, professionals, and students engaged in computer graphics, computer-aided design, and electrical engineering. Since its inception in 1996, the journal has aimed to foster innovation and collaboration within the engineering community through the dissemination of high-quality research articles, reviews, and tutorials. Positioned in the Q2 quartile across key categories like Computer Graphics and Computer-Aided Design, as well as Electrical and Electronic Engineering, it ranks within the top percentile among its peers—a testament to its scholarly impact. Readers can expect to find cutting-edge research that addresses the challenges and advancements in design automation, fostering a deeper understanding of complex electronic systems. With a commitment to excellence, ACM Transactions on Design Automation of Electronic Systems remains a vital outlet for the latest developments in its field.

SOLDERING & SURFACE MOUNT TECHNOLOGY

Connecting Research and Practice in Electronics Engineering
Publisher: EMERALD GROUP PUBLISHING LTDISSN: 0954-0911Frequency: 4 issues/year

SOLDERING & SURFACE MOUNT TECHNOLOGY is a prominent peer-reviewed journal published by Emerald Group Publishing Ltd in the United Kingdom, showcasing its commitment to advancing the fields of Electrical and Electronic Engineering, Condensed Matter Physics, and Materials Science. With a strong publication history dating back to 1989 and continuing through 2024, this journal provides a vital platform for disseminating innovative research and technological developments in soldering and surface mount technology. It holds a respectable ranking within its categories, including a Q3 classification in multiple fields according to the 2023 category quartiles, with Scopus rankings reflecting its growing influence in the academic community (e.g., #316/797 in Electrical and Electronic Engineering). While this journal does not offer open access, it remains an essential resource for researchers, practitioners, and students who aim to stay informed about cutting-edge advancements and trends in this dynamic area of study. By focusing on high-quality research contributions, SOLDERING & SURFACE MOUNT TECHNOLOGY continues to play a crucial role in fostering innovation and knowledge exchange within its scope.

STROJNISKI VESTNIK-JOURNAL OF MECHANICAL ENGINEERING

Unveiling Cutting-Edge Discoveries in Mechanical Engineering
Publisher: ASSOC MECHANICAL ENGINEERS TECHNICIANS SLOVENIAISSN: 0039-2480Frequency: 12 issues/year

STROJNISKI VESTNIK-JOURNAL OF MECHANICAL ENGINEERING is a prestigious publication that has been disseminating cutting-edge research in the field of mechanical engineering since 1974. Published by the Association of Mechanical Engineers Technicians Slovenia, this journal serves as a critical platform for professionals, researchers, and students aiming to explore advancements in mechanical engineering and mechanics of materials. With a category ranking in the Q3 quartile for both Mechanical Engineering and Mechanics of Materials, the journal reflects a robust engagement with contemporary research and practices, contributing to the ongoing discourse within these vital disciplines. Although currently not open access, the journal is committed to providing high-quality, peer-reviewed articles that facilitate knowledge sharing and innovation. It is indexed in Scopus, maintaining respectable standings within its categories, thereby underlining its importance and impact in the global academic community.

IEEE Open Journal of Industry Applications

Connecting researchers to the forefront of industrial advancements.
Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCISSN: Frequency: 1 issue/year

IEEE Open Journal of Industry Applications is a premier open-access publication established in 2020 by the esteemed IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, dedicated to advancing the fields of Control and Systems Engineering, Electrical and Electronic Engineering, and Industrial and Manufacturing Engineering. With a strong commitment to disseminating high-quality research, the journal has rapidly garnered recognition, achieving a Q1 quartile ranking in multiple engineering categories, notably securing a rank of 21st out of 321 in Control and Systems Engineering and 26th out of 384 in Industrial and Manufacturing Engineering as of 2023. This journal not only facilitates immediate access to cutting-edge findings but also fosters an inclusive academic environment where researchers, professionals, and students can engage with and contribute to the evolving landscape of industry applications. By embracing open access, it ensures that pivotal research is freely available, thereby maximizing its impact on the scientific community. For potential contributors and readers, the journal's robust Scopus rankings—placing it in the top 7% of its fields—highlight its significance as a leading platform for innovative discussions and explorations in engineering.

MICROELECTRONICS JOURNAL

Connecting Researchers with Cutting-Edge Microelectronics Knowledge
Publisher: ELSEVIER SCI LTDISSN: 0026-2692Frequency: 12 issues/year

MICROELECTRONICS JOURNAL, published by Elsevier Sci Ltd since 1974, serves as a pivotal platform for disseminating cutting-edge research in the realms of microelectronics, nanotechnology, and materials science. With editions spanning from 1974 to 2024, the journal is well-respected within the scientific community, boasting a strong presence in key categories such as Atomic and Molecular Physics, Condensed Matter Physics, and Electrical and Electronic Engineering, as evidenced by its Q3 ranking in 2023. Researchers and professionals engaged in the exploration of electronic materials, optical applications, and nanoscale innovations can greatly benefit from the journal's insights, which situate their work within a robust academic framework. Although the journal does not currently offer open access, its rigorous peer-review process and high visibility in Scopus rankings—including a percentile ranking of 58th in Condensed Matter Physics—make it an essential resource for anyone looking to stay at the forefront of advancements in microelectronics and related fields.

MICROELECTRONICS INTERNATIONAL

Fostering dialogue in the evolving world of microelectronics.
Publisher: EMERALD GROUP PUBLISHING LTDISSN: 1356-5362Frequency: 3 issues/year

MICROELECTRONICS INTERNATIONAL is a distinguished peer-reviewed journal published by Emerald Group Publishing Ltd, focusing on the expansive domains of microelectronics, materials science, and physics. With its ISSN 1356-5362 and E-ISSN 1758-812X, the journal has been a critical platform for researchers since its inception in 1982. Although it currently holds a Q4 category ranking across multiple disciplines such as Atomic and Molecular Physics, Electronic Engineering, and Surfaces, Coatings and Films, it remains committed to advancing scholarship and fostering dialogue within these fields. The journal's scope encompasses innovative research and developments that contribute to the understanding and technological evolution of microelectronic materials and systems. While it doesn't offer open access, its content is accessible through various academic databases, enabling a broad audience of professionals and enthusiasts to engage with high-quality research findings. As microelectronics continues to play a pivotal role in shaping modern technology, MICROELECTRONICS INTERNATIONAL serves as an essential resource for advancing knowledge and inspiring future innovations.

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Exploring Innovations in Device and Material Reliability for a Sustainable Future.
Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCISSN: 1530-4388Frequency: 4 issues/year

IEEE Transactions on Device and Materials Reliability stands as a leading journal in the field of reliability engineering, specializing in the intricate connections between device performance and materials efficacy. Published by the renowned IEEE-Institute of Electrical and Electronics Engineers Inc., this journal boasts a commendable impact factor and exhibits robust Scopus rankings across various categories, including electrical and electronic engineering and safety, risk, reliability, and quality. With a publication timeline from 2001 to 2024, it serves as an essential resource for researchers and professionals alike, providing comprehensive insights into current advancements and challenges in device reliability and materials science. Although it operates under a subscription model, the journal's extensive contributions are crucial for fostering significant innovations that ensure the integrity and longevity of electronic devices in a rapidly evolving technological landscape. Researchers, professionals, and students delving into this vital domain will find IEEE Transactions on Device and Materials Reliability a valuable platform to disseminate their findings and explore the latest trends.

Transactions on Electrical and Electronic Materials

Connecting Academia and Industry through Cutting-edge Research
Publisher: SPRINGERISSN: 1229-7607Frequency: 6 issues/year

Transactions on Electrical and Electronic Materials, published by Springer, is a distinguished journal aimed at advancing the fields of electrical and electronic engineering, as well as electronic, optical, and magnetic materials. With an ISSN of 1229-7607 and an E-ISSN of 2092-7592, this journal is vital in disseminating impactful research and innovations, providing insights and significant findings that cater to both academia and industry. Holding a Q3 ranking in the categories of Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, it serves as a reputable platform for sharing research that influences ongoing developments in these critical areas. The journal's converged years from 2011 to 2024 signify its commitment to providing a comprehensive review of technological advancements. Located in New York City, it appeals to a global audience of researchers, professionals, and students, enhancing their understanding of current trends and practices within the domain.