JOURNAL OF ELECTRONIC PACKAGING

metrics 2024

Advancing the Future of Electronic Packaging

Introduction

JOURNAL OF ELECTRONIC PACKAGING, published by the esteemed American Society of Mechanical Engineers (ASME), is a pivotal platform for research in the fields of Computer Science Applications, Electrical and Electronic Engineering, and Materials Science, particularly focusing on electronic packaging technologies. With an ISSN of 1043-7398 and an E-ISSN of 1528-9044, this journal has consistently showcased groundbreaking studies since its inception in 1989, projected to continue until 2025. Recognized within the Q2 quartile rankings across multiple categories in the 2023 Scopus rankings, it maintains a strong presence in the academic community with notable rankings in various engineering and materials science domains. This journal serves as a critical resource for researchers, professionals, and students who seek to advance their understanding and application of innovative electronic packaging solutions. Though it does not offer open access, it encompasses a robust array of high-quality articles that foster knowledge advancement and interdisciplinary collaboration in a rapidly evolving technological landscape, ultimately contributing to the growth and sophistication of the electronic packaging field.

Metrics 2024

SCIMAGO Journal Rank0.61
Journal Impact Factor2.20
Journal Impact Factor (5 years)2.10
H-Index60
Journal IF Without Self2.20
Eigen Factor0.00
Normal Eigen Factor0.23
Influence0.45
Immediacy Index0.90
Cited Half Life8.10
Citing Half Life8.10
JCI0.49
Total Documents1484
WOS Total Citations1644
SCIMAGO Total Citations6805
SCIMAGO SELF Citations714
Scopus Journal Rank0.61
Cites / Document (2 Years)2.34
Cites / Document (3 Years)2.24
Cites / Document (4 Years)2.33

Metrics History

Rank 2024

Scopus

Electrical and Electronic Engineering in Engineering
Rank #267/797
Percentile 66.50
Quartile Q2
Mechanics of Materials in Engineering
Rank #134/398
Percentile 66.33
Quartile Q2
Electronic, Optical and Magnetic Materials in Materials Science
Rank #100/284
Percentile 64.79
Quartile Q2
Computer Science Applications in Computer Science
Rank #322/817
Percentile 60.59
Quartile Q2

IF (Web Of Science)

ENGINEERING, ELECTRICAL & ELECTRONIC
Rank 183/352
Percentile 48.20
Quartile Q3
ENGINEERING, MECHANICAL
Rank 75/180
Percentile 58.60
Quartile Q2

JCI (Web Of Science)

ENGINEERING, ELECTRICAL & ELECTRONIC
Rank 195/354
Percentile 44.92
Quartile Q3
ENGINEERING, MECHANICAL
Rank 92/180
Percentile 48.89
Quartile Q3

Quartile History

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