JOURNAL OF ELECTRONIC PACKAGING

metrics 2024

Exploring the Frontiers of Electronic Engineering

Introduction

JOURNAL OF ELECTRONIC PACKAGING, published by the esteemed American Society of Mechanical Engineers (ASME), is a pivotal platform for research in the fields of Computer Science Applications, Electrical and Electronic Engineering, and Materials Science, particularly focusing on electronic packaging technologies. With an ISSN of 1043-7398 and an E-ISSN of 1528-9044, this journal has consistently showcased groundbreaking studies since its inception in 1989, projected to continue until 2025. Recognized within the Q2 quartile rankings across multiple categories in the 2023 Scopus rankings, it maintains a strong presence in the academic community with notable rankings in various engineering and materials science domains. This journal serves as a critical resource for researchers, professionals, and students who seek to advance their understanding and application of innovative electronic packaging solutions. Though it does not offer open access, it encompasses a robust array of high-quality articles that foster knowledge advancement and interdisciplinary collaboration in a rapidly evolving technological landscape, ultimately contributing to the growth and sophistication of the electronic packaging field.

Metrics 2024

SCIMAGO Journal Rank0.61
Journal Impact Factor2.20
Journal Impact Factor (5 years)2.10
H-Index60
Journal IF Without Self2.20
Eigen Factor0.00
Normal Eigen Factor0.23
Influence0.45
Immediacy Index0.90
Cited Half Life8.10
Citing Half Life8.10
JCI0.49
Total Documents1484
WOS Total Citations1644
SCIMAGO Total Citations6805
SCIMAGO SELF Citations714
Scopus Journal Rank0.61
Cites / Document (2 Years)2.34
Cites / Document (3 Years)2.24
Cites / Document (4 Years)2.33

Metrics History

Rank 2024

Scopus

Electrical and Electronic Engineering in Engineering
Rank #267/797
Percentile 66.50
Quartile Q2
Mechanics of Materials in Engineering
Rank #134/398
Percentile 66.33
Quartile Q2
Electronic, Optical and Magnetic Materials in Materials Science
Rank #100/284
Percentile 64.79
Quartile Q2
Computer Science Applications in Computer Science
Rank #322/817
Percentile 60.59
Quartile Q2

IF (Web Of Science)

ENGINEERING, ELECTRICAL & ELECTRONIC
Rank 183/352
Percentile 48.20
Quartile Q3
ENGINEERING, MECHANICAL
Rank 75/180
Percentile 58.60
Quartile Q2

JCI (Web Of Science)

ENGINEERING, ELECTRICAL & ELECTRONIC
Rank 195/354
Percentile 44.92
Quartile Q3
ENGINEERING, MECHANICAL
Rank 92/180
Percentile 48.89
Quartile Q3

Quartile History

Similar Journals

Functional Composites and Structures

Pioneering Research in Functional Materials.
Publisher: IOP Publishing LtdISSN: Frequency: 4 issues/year

Functional Composites and Structures is a prestigious academic journal published by IOP Publishing Ltd, dedicated to advancing the field of materials science with a focus on innovative composite materials and their structural applications. Established in 2019 and running through 2024, this journal uniquely bridges several disciplines, consistently ranking in the Q2 quartile across key categories including Ceramics and Composites, Electronic, Optical and Magnetic Materials, and Mechanics of Materials. With a commendable Scopus rank that places it within the top tiers of its field, the journal is instrumental for researchers, engineers, and scholars seeking to explore the latest developments in material properties, functionality, and applications. Although access options are not specified, the open-access nature of the journal promotes wider dissemination and engagement with cutting-edge research. As the demand for smarter, more efficient materials continues to grow, Functional Composites and Structures serves as a vital resource for fostering collaboration and driving innovation in material sciences.

SOLDERING & SURFACE MOUNT TECHNOLOGY

Unveiling Cutting-Edge Developments in Electronics
Publisher: EMERALD GROUP PUBLISHING LTDISSN: 0954-0911Frequency: 4 issues/year

SOLDERING & SURFACE MOUNT TECHNOLOGY is a prominent peer-reviewed journal published by Emerald Group Publishing Ltd in the United Kingdom, showcasing its commitment to advancing the fields of Electrical and Electronic Engineering, Condensed Matter Physics, and Materials Science. With a strong publication history dating back to 1989 and continuing through 2024, this journal provides a vital platform for disseminating innovative research and technological developments in soldering and surface mount technology. It holds a respectable ranking within its categories, including a Q3 classification in multiple fields according to the 2023 category quartiles, with Scopus rankings reflecting its growing influence in the academic community (e.g., #316/797 in Electrical and Electronic Engineering). While this journal does not offer open access, it remains an essential resource for researchers, practitioners, and students who aim to stay informed about cutting-edge advancements and trends in this dynamic area of study. By focusing on high-quality research contributions, SOLDERING & SURFACE MOUNT TECHNOLOGY continues to play a crucial role in fostering innovation and knowledge exchange within its scope.

RARE METAL MATERIALS AND ENGINEERING

Connecting Knowledge in Materials Chemistry and Engineering
Publisher: NORTHWEST INST NONFERROUS METAL RESEARCHISSN: 1002-185XFrequency: 12 issues/year

RARE METAL MATERIALS AND ENGINEERING is a vital academic journal dedicated to advancing the fields of materials science, engineering, and metallurgy. Published by the NORTHWEST INST NONFERROUS METAL RESEARCH in China, this journal has been an essential resource for researchers and professionals since its inception in 1993. With a focus on rare metals and their engineering applications, the journal addresses contemporary issues and innovations in materials chemistry and electronic engineering, providing insights into the properties and uses of advanced materials. Although it currently falls within the Q4 category for several categories, including Electrical and Electronic Engineering and Materials Chemistry, its commitment to quality and relevance in the field is evident. The journal offers a platform for researchers to share their findings with the scientific community, fostering collaboration and knowledge exchange in an important area of study. Researchers and students interested in exploring the latest in rare metal technologies and engineering methodologies will find this journal a valuable addition to their academic library.

MM Science Journal

Shaping the Future of Engineering with Every Publication.
Publisher: MM SCIENCEISSN: 1803-1269Frequency: 6 issues/year

MM Science Journal is a leading publication in the fields of Automotive Engineering, Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, and Mechanical Engineering, published by MM SCIENCE. Established in 2014 and spanning a converged period to 2024, this journal serves as a crucial platform for disseminating innovative research and practical applications relevant to industry professionals and academic scholars alike. With a notable Q3 ranking in multiple engineering categories and Scopus Ranks placing it in the 35th to 25th percentiles across various disciplines, MM Science Journal is committed to advancing knowledge and fostering collaboration in engineering disciplines. Although not currently an open-access publication, the journal remains instrumental for those seeking to engage with cutting-edge developments in engineering from its base in the Czech Republic. Researchers, students, and professionals are encouraged to explore the rich findings shared within its pages, contributing to the ongoing evolution of engineering practices.

MACROMOLECULAR RESEARCH

Leading the Charge in Macromolecular Research
Publisher: POLYMER SOC KOREAISSN: 1598-5032Frequency: 12 issues/year

MACROMOLECULAR RESEARCH, published by the POLYMER SOC KOREA, is a premier journal dedicated to advancing the field of macromolecular science and polymer engineering. With its ISSN 1598-5032 and E-ISSN 2092-7673, this journal has emerged as a vital platform for researchers and professionals interested in the application and development of polymers across various domains. Based in South Korea and operating as an open-access resource since its inception in 2002, MACROMOLECULAR RESEARCH consistently ranks in the Q2 category across diverse fields such as Chemical Engineering, Materials Chemistry, and Organic Chemistry as per the latest 2023 metrics. Notably, it is recognized for its substantial contributions to polymery science, increasing its visibility and impact in global research. By providing a forum for original research articles, reviews, and innovative methodologies, this journal aims to foster collaboration and knowledge sharing among scientists, engineers, and students alike. Join a community that is at the forefront of polymer research by exploring the wealth of resources and cutting-edge studies featured in MACROMOLECULAR RESEARCH.

Flexible and Printed Electronics

Advancing the Future of Flexible Electronics
Publisher: IOP Publishing LtdISSN: 2058-8585Frequency: 4 issues/year

Flexible and Printed Electronics, published by IOP Publishing Ltd, is a leading journal dedicated to advancing the field of flexible and printed materials within the realm of electrical and electronic engineering. With an impressive Q2 ranking in both Electrical and Electronic Engineering and Electronic, Optical, and Magnetic Materials, this journal is recognized for its significant contributions to the understanding and application of innovative electronic devices and systems. Covering a wide array of topics from materials science to engineering applications, it serves as a vital resource for researchers, professionals, and students alike. The journal's rigorous peer-review process and commitment to high-quality publications ensure that readers are exposed to cutting-edge research and developments. Submissions are welcomed from global contributors, providing a platform for the dissemination of groundbreaking ideas and technologies. With its impressive impact in the academic community, Flexible and Printed Electronics is poised to influence the future of electronics and materials technology.

ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS

Fostering Excellence in Design Automation and Engineering
Publisher: ASSOC COMPUTING MACHINERYISSN: 1084-4309Frequency: 6 issues/year

ACM Transactions on Design Automation of Electronic Systems is a premier scholarly journal published by the Association for Computing Machinery (ACM), dedicated to advancing the field of electronic system design automation. With an impact factor that reflects its influential contributions, this journal serves as an essential resource for researchers, professionals, and students engaged in computer graphics, computer-aided design, and electrical engineering. Since its inception in 1996, the journal has aimed to foster innovation and collaboration within the engineering community through the dissemination of high-quality research articles, reviews, and tutorials. Positioned in the Q2 quartile across key categories like Computer Graphics and Computer-Aided Design, as well as Electrical and Electronic Engineering, it ranks within the top percentile among its peers—a testament to its scholarly impact. Readers can expect to find cutting-edge research that addresses the challenges and advancements in design automation, fostering a deeper understanding of complex electronic systems. With a commitment to excellence, ACM Transactions on Design Automation of Electronic Systems remains a vital outlet for the latest developments in its field.

Journal of Composites Science

Pioneering Research in Composites and Ceramics
Publisher: MDPIISSN: 2504-477XFrequency: 12 issues/year

The Journal of Composites Science, published by MDPI, is a premier Open Access journal dedicated to advancing the field of composites and materials science. Launched in 2017, this innovative journal provides a platform for researchers, professionals, and students to share findings, methodologies, and insights related to composites, ceramics, and engineering applications. With an impressive Q2 ranking in both the Ceramics and Composites and Engineering (miscellaneous) categories for 2023, the journal is well-positioned within the academic community, ranking 48th out of 204 in miscellaneous engineering and 47th out of 127 in ceramics and composites according to Scopus. The journal's open-access model ensures that high-quality research is widely available to the scientific community, fostering collaboration and innovation. Situated in defensive Switzerland at ST ALBAN-ANLAGE 66, CH-4052 BASEL, the Journal of Composites Science is an essential resource for those seeking to stay at the forefront of the composites domain and drive progress in engineering practices.

Transactions on Electrical and Electronic Materials

Connecting Academia and Industry through Cutting-edge Research
Publisher: SPRINGERISSN: 1229-7607Frequency: 6 issues/year

Transactions on Electrical and Electronic Materials, published by Springer, is a distinguished journal aimed at advancing the fields of electrical and electronic engineering, as well as electronic, optical, and magnetic materials. With an ISSN of 1229-7607 and an E-ISSN of 2092-7592, this journal is vital in disseminating impactful research and innovations, providing insights and significant findings that cater to both academia and industry. Holding a Q3 ranking in the categories of Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, it serves as a reputable platform for sharing research that influences ongoing developments in these critical areas. The journal's converged years from 2011 to 2024 signify its commitment to providing a comprehensive review of technological advancements. Located in New York City, it appeals to a global audience of researchers, professionals, and students, enhancing their understanding of current trends and practices within the domain.

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Unveiling Reliability: Bridging the Gap Between Devices and Materials.
Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCISSN: 1530-4388Frequency: 4 issues/year

IEEE Transactions on Device and Materials Reliability stands as a leading journal in the field of reliability engineering, specializing in the intricate connections between device performance and materials efficacy. Published by the renowned IEEE-Institute of Electrical and Electronics Engineers Inc., this journal boasts a commendable impact factor and exhibits robust Scopus rankings across various categories, including electrical and electronic engineering and safety, risk, reliability, and quality. With a publication timeline from 2001 to 2024, it serves as an essential resource for researchers and professionals alike, providing comprehensive insights into current advancements and challenges in device reliability and materials science. Although it operates under a subscription model, the journal's extensive contributions are crucial for fostering significant innovations that ensure the integrity and longevity of electronic devices in a rapidly evolving technological landscape. Researchers, professionals, and students delving into this vital domain will find IEEE Transactions on Device and Materials Reliability a valuable platform to disseminate their findings and explore the latest trends.